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Volume 38; Issue 12
Main
Materia Japan
Volume 38; Issue 12
Materia Japan
Volume 38; Issue 12
1
Lift-off Phenomenon in Tin Binary Alloys.
Takao, Hisaaki
,
Hasegawa, Hideo
Journal:
Materia Japan
Year:
1999
File:
PDF, 2.01 MB
Your tags:
1999
2
Electrical Reliability on the Degradation due to Electrochemical Migration for PCBs.
Tsukui, Tsutomu
Journal:
Materia Japan
Year:
1999
File:
PDF, 1.44 MB
Your tags:
1999
3
Analyses of Microstructure Evolutions during Reverse Phase Transformations in Alloyed Steels Using Calculated Phase Diagrams.
Nakai, Kiyomichi
,
Shtansky, Dmitry V.
Journal:
Materia Japan
Year:
1999
File:
PDF, 3.20 MB
Your tags:
1999
4
Current Status of R&D Project of Lead-free Solders.
Suga, Tadatomo
Journal:
Materia Japan
Year:
1999
File:
PDF, 602 KB
Your tags:
1999
5
Mechanism of Lift-off Phenomenon.
Suganuma, Katsuaki
,
Ohnaka, Itsuo
,
Yasuda, Hideyuki
,
Zhu, J. D.
Journal:
Materia Japan
Year:
1999
File:
PDF, 5.06 MB
Your tags:
1999
6
Development of Plating for Lead-free Solder Joint.
Arai, Susumu
,
Shinohara, Naoyuki
,
Kaneko, Norio
Journal:
Materia Japan
Year:
1999
File:
PDF, 2.36 MB
Your tags:
1999
7
“Lead-Free Soldering”, Its Direction and Soluition
Suganuma, Katsuaki
Journal:
Materia Japan
Year:
1999
File:
PDF, 193 KB
Your tags:
1999
8
Evaluation of Solder Alloy Characteristics by a Strain Rate Changing Tensile Test.
Takemoto, Tadashi
Journal:
Materia Japan
Year:
1999
File:
PDF, 1.36 MB
Your tags:
1999
9
NCMS Lead-Free Soldering Project and NEMI Lead-Free Task Force.
Handwerker, Carol
Journal:
Materia Japan
Year:
1999
File:
PDF, 675 KB
Your tags:
1999
10
Improved Design Life and Environmentally Aware Manufacturing of Electronics Assemblies by Lead-Free Soldering.
Vincent, James H.
Journal:
Materia Japan
Year:
1999
File:
PDF, 430 KB
Your tags:
1999
11
Phase Diagrams of Pb-free Solder Alloys.
Ohnuma, Ikuo
,
Liu, Xing Jun
,
Ohtani, Hiroshi
,
Ishida, Kiyotuto
Journal:
Materia Japan
Year:
1999
File:
PDF, 538 KB
Your tags:
1999
12
Trend of Regulations for Lead use in Product and Voluntary Action Plan.
Hirano, Manabu
Journal:
Materia Japan
Year:
1999
File:
PDF, 1.86 MB
Your tags:
1999
13
Lead Free Solder Development in Computer and Comunication Equipment.
Kono, Eiichi
Journal:
Materia Japan
Year:
1999
File:
PDF, 2.48 MB
Your tags:
1999
14
Development of Lead-Free Soldering and Establishment of New Product.
Suetsugu, Kenichiro
Journal:
Materia Japan
Year:
1999
File:
PDF, 2.76 MB
Your tags:
1999
15
Small-angle X-ray Scattering Study on Microstructures of Co-Al-O Granular Films
Ohnuma, Masato
,
Hono, Kazuhiro
,
Onodera, Hidehiro
Journal:
Materia Japan
Year:
1999
File:
PDF, 3.35 MB
Your tags:
1999
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