Volume 17; Issue 2

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Microelectronics Journal
Volume 17; Issue 2

Microelectronics Journal

Volume 17; Issue 2

1

Guest Editorial

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 105 KB

english, 1986

2

The impact of surface mount technology on electronics manufacturing

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 479 KB

english, 1986

3

Designing and manufacturing Surface Mount Assemblies

Elizabeth Gunther, Charles L. Hutchins, Paul Peterson

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 401 KB

english, 1986

4

Assessing the joints in Surface-Mounted assemblies

Nihal Sinnadurai, Kenneth Cooper, John Woodhouse

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 520 KB

english, 1986

5

Handbook of microelectronics packaging and interconnection technologies: Edited by N. Sinnadurai ISBN 901150 19 3 Price £42.00/$73.00 Pages-274 + xiii; Tables-32; Figures-220; References-143; Size-23×15cm

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 78 KB

english, 1986

6

Thermal design of electronic circuit boards and packages: by D. J. Dean ISBN 901150 18 5 Price £63.00/$112.00 Pages-Approx. 400; Figures-131; References-73; Size-23×15 cm

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 78 KB

english, 1986

7

Surface mount technology experience: Problems and solutions

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 249 KB

english, 1986

8

Surface Mounted Semiconductors

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 78 KB

english, 1986

9

Current titles

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 58 KB

english, 1986

10

Semiconductor evaluation techniques

Journal:

Microelectronics Journal

Year:

1986

File:

PDF, 34 KB

1986

11

Final version: C. Cohen Pers. Comput. World vol. 8, no. 12, Dec. 1985

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 81 KB

english, 1986

12

Can computers crack the language Barrier: M. Jones Business Comput. Commun. Oct. 1985

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 81 KB

english, 1986

13

Amstrad PCW 8256: Anon Which Comput. Nov. 1985

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 81 KB

english, 1986

14

Aluminium wire for thermosonic ball bonding in semiconductor devices: Bruce L. Gehman, Keith E. Ritala and Lynn C. Erickson Solid St. Technol. 151 (October 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 94 KB

english, 1986

15

Production of hybrid circuits and quality assurance: H. Briken Feinwerktechnik Messtechnik 91 (7), 322 (1983). In German

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 94 KB

english, 1986

16

Precision fineness of grind measurement—techniques and instrumentation—for thick film pastes: Roland P. Anjard, Sr. Microelectron Reliab. 23 (2), 319 (1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 93 KB

english, 1986

17

Step coverage by vapour deposited thin aluminum films: I. A. Blech Solid St. Technol. 123 (December 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 93 KB

english, 1986

18

Designing solder paste materials to attach surface mounted devices: Barbara Roos-Kozel Solid St. Technol. 173 (October 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 93 KB

english, 1986

19

A process for two-layer gold IC metalization: Doug Summers Solid St. Technol. 137 (December 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 93 KB

english, 1986

20

Quality solder paste systems for use in microelectronic applications: Ronald P. Anjard, Sr. Solid St. Technol 183 (October 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 93 KB

english, 1986

21

Semiconductor materials and devices characterization by noise measurements: J. Graffeuil and G. Blasquez Acta Electron. 25 (3), 261 (1983). In French

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 92 KB

english, 1986

22

Radiation annealing of epitaxial silver films: J. R. Sambles, I. Coulson and D. Jarvis Vacuum 33 (10–12), 737 (1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 92 KB

english, 1986

23

High throughput variable shaped electron beam lithography: B. P. Piwczyk and A. E. Williams Solid St. Technol. 145 (September 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 97 KB

english, 1986

24

Modelling of integrated circuit defect sensitivities: C. H. Stapper IBM JI Res. Dev. 27 (6), 549 (November 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 97 KB

english, 1986

25

Parametric test system update: Peter H. Singer Semiconductor Int. 84 (September 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 79 KB

english, 1986

26

Novel IC metallization test structures for drop-in process monitors: Richard Spencer Solid St. Technol. 201 (September 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 79 KB

english, 1986

27

Failure physics of integrated circuits—a review: N. D. Stojadinovic Microelectron. Reliab. 23 (4), 609 (1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 79 KB

english, 1986

28

An analytical method for determining intrinsic drain/source resistance of lightly doped drain (LDD) devices: Charvaka Duvvury, Dave Baglee, Michael Duane, Adin Hyslop, Michael Smayling and Mike Maekawa Solid St. Electron. 27 (1), 89 (1984)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 79 KB

english, 1986

29

Profile of the worldwide Semiconductor Industry

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 61 KB

english, 1986

30

Microelectronics into the 90's: The Alvey Programme

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 559 KB

english, 1986

31

Surface mounted semiconductors: A NEW report forecasting the availability of SM Components and Board Assembly Equipments from the leading edge suppliers

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 77 KB

english, 1986

32

B. Randell, P.C. Treleaven,Editors, ,VLSI Architecture (1983) Prentice Hall International.

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 70 KB

english, 1986

33

s2

Richard Bayford

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 143 KB

english, 1986

34

The Korean Semiconductor Industry

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 75 KB

english, 1986

35

Research and Development

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 247 KB

english, 1986

36

Sophisticated page makeup gets personal: J. Canuoto Comput. Graphics World vol. 8, no. 9, Sept. 1985

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 94 KB

english, 1986

37

Reading and writing the electronic book: N. Yankelovich, N. Megrowitz and A. Van Dam Computer vol. 18, no. 10, Oct. 1985

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 94 KB

english, 1986

38

High thermal conduction package technology for flip chip devices: Masanobu Kohara, Shin Nakao, Kazuhito Tsutsumi, Hiroshi Shibata and Hidefumi Nakata IEEE Trans. Components Hybrids Mfg Technol. Chmt-6 (3), 267 (September 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 94 KB

english, 1986

39

A new chip carrier for high performance applications: integrated decoupling capacitor chip carrier (IDCCC): Christian M. Val and Jaques E. Martin IEEE Trans. Components Hybrids Mfg Technol. Chmt-6 (3), 290 (September 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 186 KB

english, 1986

40

A low-leakage VLSI CMOS/SOS process with thin epilayers: J. Y. Lee, D. C. Mayer and P. K. Vasudev Microelectron J. 14 (6), 5 (1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 93 KB

english, 1986

41

The effect of hydrogen ambients on electromigration kinetics in A1–2% Cu thin film conductors: R. W. Pasco, L. E. Felton and J. A. Schwarz Solid St. Electron. 26 (11), 1053 (1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 92 KB

english, 1986

42

X-ray lithography: optical's heir: Pieter S. Burggraaf Semiconductor Int. 60 (September 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 92 KB

english, 1986

43

Top-edge imaging in E-beam lithography: S. J. Gillespie Solid St. Technol. 174 (September 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 92 KB

english, 1986

44

Characterization of ion implanted silicon—applications for IC process control: Matthew Markert and Michael I. Current Solid St. Technol. 101 (November 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 92 KB

english, 1986

45

Some present and future applications of laser processing—an overview: Edward J. Swenson Solid St. Technol. 156 (November 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 187 KB

english, 1986

46

A process-compatible electron beam direct write system: W. R. Livesay, J. S. Greeneich, J. E. Wolfe and R. J. Felker Solid St. Technol. 137 (September 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 97 KB

english, 1986

47

Recent developments in the characteristics of semiconductors by transport measurements: P. Blood and J. W. Orton Acta Electron. 25 (2), 103 (1983). In French

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 97 KB

english, 1986

48

Current methods for silicon wafer characterization: John H. Matlock Solid St. Technol. 111 (November 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 97 KB

english, 1986

49

Analysis of leakage currents in CMOS/SOS devices: K. Vasudev Microelectron. J. 14 (6), 45 (1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 174 KB

english, 1986

50

A strategy for rule verification shrinks LSI layouts: Clark Beck and Steve Hardy Electronics 141 (15 December 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 79 KB

english, 1986

51

Structural characterization of processed silicon wafers: Peter L. Fejes, H. Ming Liaw and F. Secco D'Aragona IEEE Trans. Components Hybrids Mfg Technol. Chmt-6 (3), 314 (September 1983)

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 79 KB

english, 1986

52

Forthcoming events

Journal:

Microelectronics Journal

Year:

1986

Language:

english

File:

PDF, 224 KB

english, 1986