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Volume 28; Issue 5
Main
Microelectronics Reliability
Volume 28; Issue 5
Microelectronics Reliability
Volume 28; Issue 5
1
Calendar of international conferences, symposia, lectures and meetings of interest
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 125 KB
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english, 1988
2
Publications, notices, calls for papers, etc.
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 407 KB
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english, 1988
3
Comments on “Stochastic analysis of a two unit cold standby system with preparation time for repair”
Guo Tong De
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 40 KB
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english, 1988
4
Some techniques of minimum mean square error estimation
M.C. Shah
,
R. Parmar
,
V.P. Gupta
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 166 KB
Your tags:
english, 1988
5
Software metrics: Measuring the progress of software development
Tuyet-Lan Tran
,
Yosef S. Sherif
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 416 KB
Your tags:
english, 1988
6
Testing whether F is “more IFRA than is G”
Ram C. Tiwari
,
Jyoti N. Zalkikar
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 373 KB
Your tags:
english, 1988
7
Reliability physics and a new discipline
Guang-Bo Gao
,
Xiang Gui
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 566 KB
Your tags:
english, 1988
8
A probabilistic model of quality control in microelectronics
Barbara E. Wojcik
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 254 KB
Your tags:
english, 1988
9
Probabilistic analysis of K-out-of-N:F three state-unit redundant system with common-cause failure and replacements
M. Mahmoud
,
N.A. Mokhles
,
E.H. Saleh
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 416 KB
Your tags:
english, 1988
10
Some criteria for reliability growth
Laurence A. Baxter
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 286 KB
Your tags:
english, 1988
11
Estimation of the Weibull renewal function
Jill Card
,
Wai Chan
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 252 KB
Your tags:
english, 1988
12
In-process voltage stressing to increase reliability of MOS integrated circuits
George L. Schnable
,
George A. Swartz
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 1.08 MB
Your tags:
english, 1988
13
An improved method of enumerating all trees and minimal paths in a graph using Petri nets
J.M. Kontoleon
,
D. Mandaltsis
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 276 KB
Your tags:
english, 1988
14
Hypermedia and network reliability
Lavon B. Page
,
Jo Ellen Perry
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 809 KB
Your tags:
english, 1988
15
On the relationship between component failure rate and stress-strength distributional characteristics
Kecheng Shen
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 340 KB
Your tags:
english, 1988
16
Study of acceleration factor on moisture resistance test of plastic encapsulated semiconductor devices
T. Wada
,
Y. Kobayashi
,
N. Maeda
,
M. Sugimoto
,
T. Ajiki
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 321 KB
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english, 1988
17
Chemical vapor deposition for microelectronics: Principles, Technology, and Applications Author: Arthur Sherman Publishers: Noyes Publications, Publicity Department, Mill Road at Grand Avenue, Park Ridge, New Jersey 07656, United States of America. Price: $ 48.00. ISBN 0-8155-1136-1. Published 1987
G.W.A.D.
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 45 KB
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english, 1988
18
Modern techniques of surface science: Cambridge Solid State Science Series Authors: D.P. Woodruff and T.A. Delchar Publishers: Cambridge University Press, 32, East 57th Street, New York, New York 10022, United States of America. Price: $ 24.95. ISBN 0-521-35719-5. Published 1988
G.W.A.D.
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 52 KB
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english, 1988
19
Introduction to microelectronic fabrication: Modular Series on Solid State Devices Editors: Gerold W. Neudeck and Robert F. Pierret Author: Richard W. Jaeger Publishers: Addison-Wesley Publishing Company, Inc., Reading, Massachusetts, 01867, United States of America. ISBN 0-201-14695-9. Published 1988
G.W.A.D.
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 32 KB
Your tags:
english, 1988
20
R&M 2000 and environmental stress screening : Joseph L. Capitano. IEEE Trans. Reliab.R-36, 346 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 92 KB
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english, 1988
21
Trends in parametric test systems : David A. Angst and Joe Domitrowich. Semiconductor int., 173 (September 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 92 KB
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english, 1988
22
Theoretical and experimental study of subsurface burnout and ESD in GaAs FETs and HEMTs : F. A. Buot, W. T. Anderson, A. Christou and K. J. Sleger. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 181 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 92 KB
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english, 1988
23
Analysis of CMOS transistor instabilities : S. Dimitrijev and N. Stoijadinovic. Solid-St. Electron.30, 991 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 219 KB
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english, 1988
24
Electromigration testing of Ti/Al-Si metallization for integrated circuits : Jose A. Maiz and Babak Sabi. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 145 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 127 KB
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english, 1988
25
Computer guided logic IC fault location : Jeffrey L. Rauwerdink. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 107 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 127 KB
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english, 1988
26
Reliability of high frequency high power GaAs MESFETs : S. Kashiwagi, S. Takase, T. Usui and T. Ohono. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 97 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 127 KB
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english, 1988
27
Measurement of silicon strength as affected by wafer back processing : George Hawkins, Howard Berg, Mali Mahalingam, Gary Lewsis and Lynn Lofgran. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 216 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 127 KB
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english, 1988
28
Thermal fatigue reliability of SMT packages and interconnections : J. Lau, G. Harkins, D. A. Rice and J. Kral. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 250 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 127 KB
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english, 1988
29
Association of bonding-wire displacement with gas bubbles in plastic-encapsulated integrated circuits : William L. Hunter. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 327 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 127 KB
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english, 1988
30
The microstructure of ball bond corrosion failures : K. N. Ritz, W. T. Stacy and E. K. Broadbent. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 28 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 127 KB
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english, 1988
31
Reliability of nano-meter thick multi-layer dielectric films on poly-crystalline silicon : Y. Ohji, T. Kusaka, I. Yoshida, A. Hiraiwa, K. Lyagi, K. Mukai and O. Kasahara. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 55 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 127 KB
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english, 1988
32
A novel thermal expansion matched heatspreader for plastic encapsulation of silicon chips : J. W. McPherson and G. A. Bednarz. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 224 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 127 KB
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english, 1988
33
Novel failure mechanism and anomalous acceleration factor on a beam-lead IC : P. L. Scarff and M. Iannuzzi-Glogovsky. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 42 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 130 KB
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english, 1988
34
Stress related failures causing open metallization : Steven K. Groothuis and Walter H. Schroen. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 1 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 130 KB
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english, 1988
35
Highly reliable trench capacitor with SiO2/Si3N4/SiO2 stacked film : T. Watanabe, N. Goto, N. Yasuhisa, T. Yanase, T. Tanaka and S. Shinozaki. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 50 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 130 KB
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english, 1988
36
Elastoplastic analysis of surface-mount solder joints : John H. Lau, Donald W. Rice and Phil A. Avery. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 346 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 130 KB
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english, 1988
37
The effect of Cu addition to Al-Si interconnects on stress induced open-circuit failures : S. Mayumi, T. Unemoto, M. Shishino, H. Nanatsue, S. Ueda and M. Inoue. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 15 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 130 KB
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english, 1988
38
Is the incoming physical inspection of microelectronic components really necessary? : B. P. Richards and P. K. Footner. Microelectron. J.18 (6), 4 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 130 KB
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english, 1988
39
Cost-density analysis of interconnections : George Messner. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 143 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 130 KB
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english, 1988
40
Micro-corrosion of Al-Cu bonding pads : Simon Thomas and Howard M. Berg. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 252 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 130 KB
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english, 1988
41
Electrical conduction mechanisms of barium-titanate-based thick-film capacitors : In K. Yoo, Larry C. Burton, F. William Stephenson. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 274 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 253 KB
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english, 1988
42
Investigations of large PLCC package cracking during surface mount exposure : Terry O. Steiner and David Suhl. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 209 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 125 KB
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english, 1988
43
Test et encapsulation des circuits intégrés logiques GaAs: M. Gloanec and J. Jarry. Revue Tech. Thomson-CSF18, 695 (1986) (in French)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 125 KB
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english, 1988
44
Stress analysis of partially yielded soldered joint for surface mount connectors : Shoji E. Yamada. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 236 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 125 KB
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english, 1988
45
Life expectancy of communication satellites : Paul Gallois. Electron. Power, 547 (September 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 125 KB
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english, 1988
46
Controlled electromigration for field failure acceleration : Frank Juskey. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 370 (September 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 125 KB
Your tags:
english, 1988
47
The effects of processing of EEPROM reliability : D. A. Baglee, T. Sugawara, S. Fukawa, K. Mori, L. M. Bellay and T. Miller. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 93 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 125 KB
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english, 1988
48
The impact of R&M 2000 on MCAIR integrated logistic support : A. R. Morse and H. W. Fannin. IEEE Trans. Reliab.R-36, 362 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 125 KB
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english, 1988
49
A modified Monte Carlo technique for confidence limits of system reliability using pass-fail data : Anne Chao and L.-C. Huwang. IEEE Trans. Reliab.R-36, 109 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 251 KB
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english, 1988
50
Reliability and key-protection for computer-security systems : Tsong-Ho Wu and Kim-Joan Chen. IEEE Trans. Reliab.R-36, 113 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 126 KB
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english, 1988
51
A sequence of diagnosis and repair for a 2-state repairable system : Qin Zhang. IEEE Trans. Reliab.R-36, 32 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 126 KB
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english, 1988
52
Recursive technique for computing system reliability : Suresh Rai and Arun Kumar. IEEE Trans. Reliab.R-36, 38 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 126 KB
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english, 1988
53
Uncertainty propagation in fault tree analyses using lognormal distributions : Marcelo Masera. IEEE Trans. Reliab.R-36, 145 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 126 KB
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english, 1988
54
Reliability of standby equipment with periodic testing : S. H. Sim. IEEE Trans. Reliab.R-36, 117 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 126 KB
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english, 1988
55
How to identify a bathtub hazard rate : Magne Vollan Aarset. IEEE Trans. Reliab.R-36, 106 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 126 KB
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english, 1988
56
Fast recursive algorithm to evaluate the reliability of a circular consecutive-k-out-of-n:F system: Ira Antonopoulou and Stavros Papastavridis. IEEE Trans. Reliab.R-36, 83 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 126 KB
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english, 1988
57
A stable algorithm to calculate steady-state probability and frequency of a Markov system : Sudhir Kumar, Winfried Grassmann and Roy Billinton. IEEE Trans. Reliab.R-36, 58 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 126 KB
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english, 1988
58
An algorithm for symbolic reliability computation with path-sets or cut-sets : Clement C. Fong and John A. Buzacott. IEEE Trans. Reliab.R-36, 34 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 126 KB
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english, 1988
59
Mean time to failure for a consecutive-k-out-of-n:F system: Stavros Papastavridis and John Hadjichristos. IEEE Trans. Reliab.R-36, 85 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 126 KB
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english, 1988
60
On reliability of a large consecutive-k-out-of-n:F system with (k-l)-step Markov dependence: James C. Fu and Beihua Hu. IEEE Trans. Reliab.R-36, 75 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 126 KB
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english, 1988
61
A method to estimate the Weibull parameters for progressively censored tests : Mario Cacciari and Gian Carlo Montanari. IEEE Trans. Reliab.R-36, 87 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 131 KB
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english, 1988
62
Reliability of a consecutive-k-out-of-n:F system for Markov-dependent components: Stavros Papastavridis and Menelaos Lambiris. IEEE Trans. Reliab.R-36, 78 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 131 KB
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english, 1988
63
Air force systems command approach to R&M : M. T. Smith. IEEE Trans. Reliab.R-36, 291 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 131 KB
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english, 1988
64
R&M 2000. An Air Force Logistics Command challenge do it now : Richard D. Smith. IEEE Trans. Reliab.R-36, 299 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 131 KB
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english, 1988
65
R&M 2000: cutting the tether : IEEE Trans. Reliab.R-36, 281 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 131 KB
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english, 1988
66
On the implications of R&M 2000 environmental stress screening : A. E. Saari. IEEE Trans. Reliab.R-36, 342 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 131 KB
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english, 1988
67
US Army reliability initiatives—in concert with Air Force R&M 2000 : S. J. Lorber. IEEE Trans. Reliab.R-36, 313 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 262 KB
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english, 1988
68
The R&M 2000 initiative Air Force R&M policy letters : John L. Piotrowski. IEEE Trans. Reliab.R-36, 278 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 132 KB
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english, 1988
69
R&M 2000. The Tactical Air Command approach : Jimmie V. Adams. IEEE Trans. Reliab.R-36, 297 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 132 KB
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english, 1988
70
Half-maintainability — a formidable goal : Bernard L. Retterer and Ned H. Criscimagna. IEEE Trans. Reliab.R-36, 324 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 132 KB
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english, 1988
71
Optimal logic for multi-channel protective systems duing online maintenance : Takehisa Kohda, Hiromitsu Kumamoto, Koichi Inoue and Ernest J. Henley. IEEE Trans. Reliab.R-36, 25 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 132 KB
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english, 1988
72
R&M 2000. The Strategic Air Command perspective : James P. McCarthy. IEEE Trans. Reliab.R-36, 295 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 132 KB
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english, 1988
73
R&M 2000 and the Air Force acquisition process : Bernard P. Randolph. IEEE Trans. Reliab.R-36, 287 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 132 KB
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english, 1988
74
R&M 2000 environmental stress screening : John W. Littlefield. IEEE Trans. Reliab.R-36, 335 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 132 KB
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english, 1988
75
R&M 2000. The engineering connection : Frank S. Goodell. IEEE Trans. Reliab.R-36, 303 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 132 KB
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english, 1988
76
A new Monte Carlo method for evaluating system-failure probability : Hiromitsu Kumamoto, Tsunehiko Tanaka and Koichi Inoue. IEEE Trans. Reliab.R-36, 63 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 247 KB
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english, 1988
77
R&M 2000—coequality between R&M, cost, performance, and schedule : Robert A. Jaquess. IEEE Trans. Reliab.R-36, 331 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 115 KB
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english, 1988
78
‘Double-R/half-M’, a reasonable design objective? : Carl M. Bird. IEEE Trans. Reliab.R-36, 321 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 115 KB
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english, 1988
79
A test to identify the uniform distribution, with applications to probability plotting and other distributions : Smiley W. Cheng and F. A. Spiring. IEEE Trans. Reliab.R-36, 98 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 115 KB
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english, 1988
80
Closed formulas for the failure probability of a strict-consecutive-k-out-of-n:F system: Andreas N. Philippou and Frosso S. Makri. IEEE Trans. Reliab.R-36, 80 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 115 KB
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english, 1988
81
The Navy's best practices approach to reliability and quality : W. J. Willoughby Jr.IEEE Trans. Reliab.R-36, 310 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 115 KB
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english, 1988
82
Comparison of wafer scale integration with VLSI packaging approaches : Constantine A. Neugebauer and Richard O. Carlson. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 184 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 115 KB
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english, 1988
83
Electrical performances of devices made in SiO films obtained by lamp ZMR : Michael Haond, Duy-Phach Vu, Agustin Monroy Aguirre and Sylviane Perret. IEEE Circuits Devices Mag., 27 (July 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 115 KB
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english, 1988
84
Advantages of a floating annular ring in three-layer tab assembly : Steven T. Holzinger and Brett Sharenow. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 332 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 243 KB
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english, 1988
85
New process for automated IC assembly manufacturing : Daniel J. Quinn and Robert H. Bond. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 391 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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86
Thermal management of air- and liquid-cooled multichip modules : Avram Bar-Cohen. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 159 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
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87
Optimizing the wire-bonding process for copper ball bonding, using classic experimental designs : Michael Sheaffer, Lee R. Levine and Brian Schlain. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 321 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
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88
The fundamental limits for electronic packaging and systems : William E. Pence and J. Peter Krusius. IEEE Trans. Compon. Hydrids mfg Technol.CHMT-10, 176 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
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89
Surface attach chip carriers for conventional and high-performance applications : Frank Stark. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 152 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
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90
Wet bench fire suppression : Peter H. Singer. Semiconductor int., 154 (September 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
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91
Resist image reversal for next-generation VLSI circuit fabrication : John Hock, Charles King and John Helbert. Semiconductor int., 164 (September 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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92
Gas purity requirements for titanium silicide metalization : Henry Berger. Semiconductor int., 137 (September 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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93
The clean module: advanced technology for processing silicon wafers : D. I. Golland, P. D. Albrecht, W. C. Krussel and P. A. Puerto. Semiconductor int., 184 (September 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
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94
Electrical modeling of interconnections in multilayer packaging structures : Algierd A. Palusinski, J. C. Liao, Paul E. Teschan, John L. Prince and Francisco Quintero. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 217 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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95
Investigation of aluminum ball bonding mechanism : Jin Onuki, Masateru Suwa, Masahiro Koizumi and Tomio Iizuka. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 242 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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96
Buried coaxial conductors for high-speed interconnections : Richard C. Landis. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 204 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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97
High-frequency performance of TAB : Dennis Herrell and David Carey. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 199 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 112 KB
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98
FIST—Ein symbolisches VLSI-design-system (FIST—a symbolic VLSI design-system) : Philip Dellafera. Frequenz41, 228 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 112 KB
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english, 1988
99
Les circuits intégrés GaAs: J. Magarshack. Revue tech. Thomson-CSF18, 671 (1986) (in French)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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100
Circuits intégrés logiques GaAs et leurs évaluations: E. H. Perea. Revue tech. Thomson-CSF18, 677 (1986) (in French)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 112 KB
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101
Oxide thickness determination in Cr-SiO2-Si structures by dc current-voltage pairs : X. Aymerich-Humet, F. Campabadal and F. Serra-Mestres. Vacuum37, 403 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 112 KB
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102
Epitaxial growth of in situ doped silicon by LPCVD : C. Domingues, G. Pastor and E. Dominguez. Vacuum37, 407 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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103
Effects of the atmosphere on the resistance of ITO thin films : Josep Calderer. Vacuum37, 441 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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104
Hybrid ICs vital to high density mounting : J Electron. Engng, 36 (October 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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105
Optical properties of reactively sputtered silicon nitride films : E. Paule, E. Elizalde, J. M. Martinez-Duart and J. M. Albella. Vacuum37, 395 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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106
Hybrid ICs make the most of limited space : Henk Sanders. J Electron. Engng, 38 (October 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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107
A new failure mode of very thin (< 50 Å) thermal SiO2 films : Thao N. Nguyen, P. Olivo and B. Ricco. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 66 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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108
QC/QA for hybrid circuit manufacturing: a broader role : Stephan Gunsaulus. Semiconductor int., 114 (September 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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109
Fabrication of 16-bit DAC using infrared fired thick-film process : M. K. Rao, Kwang Yeong Chua and Sea Leong Lim. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 364 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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110
Advanced copper/polyimide hybrid technology : Hayato Takasago, Mitsuyuki Takada, Kohei Adachi, Atsushi Endo, Kurumi Yamada, Tetsuro Makita, Eishi Gofuku and Yoichiro Onishi. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 425 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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111
Smell identification using a thick-film hybrid gas sensor : Masayoshi Kaneyasu, Akira Ikegami, Hideo Arima and Shoichi Iwanaga. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 267 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
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112
A new VLSI diagnosis technique: focused ion beam assisted multi-level circuit probing : Y. Mashiko, H. Morimoto, H. Koyama, S. Kawazu, T. Kaito and T. Adachi. Annual Proceedings of the Reliability Physics Symposium, San Diego, U.S.A., p. 111 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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113
Scanning electron microscopy for production : Pieter Burggraaf. Semiconductor int., 51 (August 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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114
Simulation of resist profiles in single and triple layer electron beam lithography : P. R. Deshmukh, N. K. L. Raja and W. S. Khokle. Microelectron. J.18 (6), 32 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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115
Planarization of sputtered aluminum : S. Gupta, I. Wagner, S. Hurwitt and L. Wharton. Semiconductor int., 126 (September 1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 113 KB
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116
A new laser hermetic sealing technique for aluminum package : Takeaki Sakai, Shigeki Okamoto, Tsutomu Iikawa, Takehiko Sato and Zenzo Henmi. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 433 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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117
Automation of solder joint inspection procedures utilizing laser induced infrared : Gary W. Fugate and Joe R. Felty. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 374 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 113 KB
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118
Boron implantation effects on Au: GaAs Schottky barrier : A. Perez, P. Roura, J. Esteve, H. Altelarrea, J. A. Anton, A. Cornet and J. R. Morante. Vacuum37, 415 (1987)
Journal:
Microelectronics Reliability
Year:
1988
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english
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119
Ion implantation : D. G. Armour. Vacuum37, 423 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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120
Boron implantation influence on the backgating effect in GaAs MESFETs : J. Samitier, A. Herms, A. Cornet and J. R. Morante. Vacuum37, 411 (1987)
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
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english, 1988
121
4724965 Device for conveying components, particularly integrated chips, from an input magazine to an output magazine
Hans-Heinrich Willberg
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 80 KB
Your tags:
english, 1988
122
4725775 Resistor isolated burn-in socket board
Tommy McMinn
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 80 KB
Your tags:
english, 1988
123
4726021 Semiconductor memory having error correcting means
Masashi Horiguchi
,
Masakazu Aoki
,
Yoshinob Nakagome
,
Shinichi Ikenaga
,
Katsuhiro Shimohigashi
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 80 KB
Your tags:
english, 1988
124
4726023 Determination of testability of combined logic end memory by ignoring memory
JohnL Carter
,
LeendertM Huisman
,
ThomasW Williams
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 93 KB
Your tags:
english, 1988
125
4726024 Fail safe architecture for a computer system
Robert Guziak
,
EdwardK Prem
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 93 KB
Your tags:
english, 1988
126
4727317 Device orientation test method suitable for automatic test equipment
MartinJ Oliver
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 93 KB
Your tags:
english, 1988
127
4727516 Semiconductor memory device having redundancy means
Masahiro Yoshida
,
Kanji Oishi
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 152 KB
Your tags:
english, 1988
128
4728885 Method and apparatus for duplicating electrical environmental conditions
JosephJ DeSanto
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 60 KB
Your tags:
english, 1988
129
4729126 Method and apparatus for supervising the accessing and testing of communication systems
DavidJ Okek
Journal:
Microelectronics Reliability
Year:
1988
Language:
english
File:
PDF, 60 KB
Your tags:
english, 1988
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