Volume 30; Issue 5

Microelectronics Reliability

Volume 30; Issue 5

1

A model for mechanisms in plastic encapsulated microelectronic devices during temperature-humidity tests—I

Guenter Matthaei

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 472 KB

english, 1990

2

Modelling of thermal fatigue failure in soft-soldered semiconductor devices using the internal variable method

A. Chen, X. Gui, G.-B. Gao

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 303 KB

english, 1990

3

Stochastic analysis of a multi-unit cold standby system working in orbit form

L.R. Goel, Rakesh Gupta, S.E. Moafi B

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 289 KB

english, 1990

4

The definition of two-phase repair member capacity of complex radioelectronic systems

Oleg Martynenko

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 248 KB

english, 1990

5

The limit conditions of five failure counting models of software reliability

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 294 KB

english, 1990

6

Reliability and MTTF analysis of a three-state multi-component parallel redundant system under overloading effect and waiting

P.P. Gupta, Anju Singhal, G.S. Srivastava

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 182 KB

english, 1990

7

A two-unit standby power plant with imperfect switching

P.P. Gupta, Shashi Sharma, R.K. Sharma

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 164 KB

english, 1990

8

Stochastic behaviour of a cold standby system with partial failure and slow switching device

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 232 KB

english, 1990

9

Comparison of some ratio-type estimators

B.V.S. Sisodia, Sunil Kumar

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 228 KB

english, 1990

10

VLSI semiconductor random access memory functional testing

Venkatapathi Naidu Rayapati

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 774 KB

english, 1990

11

Classification of fault trees and algorithms of fault tree analysis

Yan Chunning, Shi Dinghua

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 299 KB

english, 1990

12

Maintenance philosophy using queueing multilevel stochastic service system

V.M. Cátuneanu, C. Moldovan, F. Popentiu, G. Albeańu

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 274 KB

english, 1990

13

Thermally induced parasitic ungated FET in power MESFETs

C. Canali, E. Corti, F. Magistrali, M. Sangalli, A. Paccagnella, C. Tedesco, M. Vanzi

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 289 KB

english, 1990

14

Reliability analysis of a k-out-of-N : G redundant system with multiple critical errors

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 186 KB

english, 1990

15

Determination of local stress in PECVD nitride films

G. Gspan, R. Osredkar

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 174 KB

english, 1990

16

Environmental and technological risks and hazards

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 1.99 MB

english, 1990

17

The scaled-down circuit yield improvement by technological centering

Marek J. Patyra, Jan Zabrodzki

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 547 KB

english, 1990

18

Human error data banks

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 462 KB

english, 1990

19

Optimal replacement policy (N∗, n∗) for a parallel system with common cause failure and geometric repair time

Min-Tsai Lai, John Yuan

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 339 KB

english, 1990

20

Society of reliability engineers bulletin

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 71 KB

english, 1990

21

The Romanian Reliability Society

Florin Popentiu

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 32 KB

english, 1990

22

Conference report Reliability and Maintainability Symposium (RAMS 1990)

Richard M. Jacobs

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 312 KB

english, 1990

23

Multilayer bonding guide: A Comprehensive Treatise on the Bonding of Multilayers Author: Manfred Huschka Publishers: Technical reference publications limited Asahi House, Church Road, Port Erin, ISLE of man. (British Isles). Price: UK £ 39.00 (plus £ 2.50 postage) Elsewhere: US $ 78.00 (plus $ 14.00 airmail) (or $ 5.00 surface mail). ISBN 1 872 422 00 4. Published 1990

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 39 KB

english, 1990

24

Applied electromagnetics in materials: Edited by: K. Miya Publishers: Pergamon Press Headington Hill Hall Oxford OX3 OBW England Price: £ 55.00 ($ 99.00). Published 1989. (ISBN 0-08 037191-4)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 65 KB

english, 1990

25

Calendar of international conferences, symposia, lectures and meetings of interest

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 131 KB

english, 1990

26

Publications, notices, calls for papers, etc.

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 277 KB

english, 1990

27

Avoiding electrolytic and strain-induced shorting mechanisms—a review : T. T. Hitch. Circuit Wld16(2), 41 (1990)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 98 KB

english, 1990

28

R&M-CAE implementation issues in electronics development : David W. Anders. Proc. Reliab. Maintainab. CAE Workshop, 17 (1988)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 98 KB

english, 1990

29

Integration of R&M into CAE for product excellence : William I. Henry. Proc. Reliab. Maintainab. CAE Workshop, 9 (1988)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 98 KB

english, 1990

30

Objective and subjective estimates of human error : Neville Moray. IEEE Trans. Reliab.38(3), 301 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 123 KB

english, 1990

31

Concurrent design : Michael G. Pecht. Proc. Reliab. Maintainab. CAE Workshop, 45 (1988)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 123 KB

english, 1990

32

Mechanical-reliability prediction : Jimmie J. Nelson. Proc. Reliab. Maintainab. CAE Workshop, 42 (1988)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 123 KB

english, 1990

33

R&M-CAE in a joint venture : Damond Osterhus and Anne Marie Leone. Proc. Reliab. Maintainab. CAE Workshop, 23 (1988)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 123 KB

english, 1990

34

Non-existent CAE capabilities : Philip J. Broughton. Proc. Reliab. Maintainab. CAE Workshop, 39 (1988)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 123 KB

english, 1990

35

Hidden dependence in human errors : C. Michael Lewis and William Wren Stine. IEEE Trans. Reliab.38(3), 296 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 123 KB

english, 1990

36

DoD/industry studies related to CALS R&M : Larry Griffin. Proc. Reliab. Maintainab. CAE Workshop, 31 (1988)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 123 KB

english, 1990

37

Limitations in the current R&M-CAE viewpoint : Keith M. Janasak. Proc. Reliab. Maintainab. CAE Workshop, 34 (1988)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 123 KB

english, 1990

38

Gate oxide breakdown statistics in wearout tests of metal-oxide-semiconductor structures : J. Sune, I. Placencia, E. Farres, N. A. Barniol, F. Martin and X. Aymerich. Microelectron. J.20(6), 27 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 134 KB

english, 1990

39

Safety and environmental problems of cleaning printed circuit assemblies : B. N. Ellis. Circuit Wld16(1), 4 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 134 KB

english, 1990

40

Investigation of gate oxide breakdown in CMOS integrated circuits : B. Pesic, S. Dimitrijev and N. Stojadinovic. Microelectron. J.20(6), 19 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 134 KB

english, 1990

41

Quo Vadis printed (circuit) board? Seeking the most cost-effective interconnect solution for electronic equipment : M. Weinhold. Circuit Wld16(1), 13 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 134 KB

english, 1990

42

PCB plated through hole optimisation: a case study in SPC : M. J. Harry. Circuit Wld16(1), 33 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 134 KB

english, 1990

43

On the evaluation of ferroelectric nonlinear capacitors for application in power circuits : Adolf G. K. Lutsch, Jacobus Daniel van Wyk and Jurgens Johannes Schoeman. IEEE Trans. Compon. Hybrids mfg Technol.12(3), 352 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 134 KB

english, 1990

44

Analysis and evaluation of TAB bonds : T. C. Chung and H. A. Moore. Circuit Wld16(1), 8 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 134 KB

english, 1990

45

Cracking of solder connections on paper-base-phenolic printed wiring board : Shoji E. Yamada. J. Electron. Engng, Jpn, 40 (October 1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 263 KB

english, 1990

46

Edge passivation and related electrical stability in silicon power devices : S. Salkalachen, N. H. Krishnan, S. Krishnan, H. B. Satyamurthy and K. S. Srinivas. IEEE Trans. Semiconductor Mfg3(1), 12 (1990)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 128 KB

english, 1990

47

Inspection and data measurements for solder quality process control : J. Adams. Circuit Wld16(1), 19 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 128 KB

english, 1990

48

Test chip based approach to automated diagnosis of CMOS yield problems : Wes Lukaszek, Kai G. Grambow and Willie J. Yarbrough. IEEE Trans. Semiconductor Mfg3(1), 18 (1990)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 128 KB

english, 1990

49

Analysis of faults of integrated circuits with the JENATECH-inspection microscope : Udo Mutze. Jena Rev.3, 118 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 128 KB

english, 1990

50

RADC initiatives in CAE for reliability and maintainability : Anthony Coppola. Proc. Reliab. Maintainab. CAE Workshop, 6 (1988)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 128 KB

english, 1990

51

High-speed automatic test equipment enhances audio/video production lines : Tamio Sakai. J. Electron. Engng, Jpn, 56 (September 1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 128 KB

english, 1990

52

Feedback approach to quality monitoring of a manufacturing process : John R. English, Murali Krishnamurthi and Tep Sastri. Comput. ind. Engng17(1–4), 303 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 128 KB

english, 1990

53

A SIMNET simulation model for estimating system reliability : Hamdy A. Taha and Pablo Nuno de la Parra. Comput. ind. Engng17(1–4), 317 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 128 KB

english, 1990

54

Quality function deployment (QFD) processes in an integrated quality information system : Chia-Hao Chang. Comput. ind. Engng17(1–4), 311 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 128 KB

english, 1990

55

Bivariate mean residual life : K. R. Muralidharan Nair and N. Unnikrishnan Nair. IEEE Trans. Reliab.38(3), 362 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 257 KB

english, 1990

56

A prolog based expert system for the allocation of quality assurance program resources : Kyle A. Crawford and Osama K. Eyada. Comput. ind. Engng 17(1–4), 298 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 129 KB

english, 1990

57

The role of inspection in automated manufacturing : Ahmad K. Elshennawy. Comput. ind. Engng17(1–4), 327 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 129 KB

english, 1990

58

On a common error in open and short circuit reliability computation : David M. Malon. IEEE Trans. Reliab.38(3), 275 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 129 KB

english, 1990

59

An interactive knowledge-based system for forecasting new product reliability : Suheil M. Nassar and W. E. Souder. Comput. ind. Engng17(1–4), 323 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 129 KB

english, 1990

60

Economically based acceptance sampling plans : Michael S. Wall and Ahmad K. Elshennawy. Comput. ind. Engng17(1–4), 340 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 129 KB

english, 1990

61

Reliability analysis of a class of fault-tolerant systems : Hoang Pham and Shambhu J. Upadhyaya. IEEE Trans. Reliab.38(3), 333 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 129 KB

english, 1990

62

On estimating the mean time to failure with unknown censoring : Ramalingam Shanmugam and Dale O. Richards. IEEE Trans. Reliab.38(3), 343 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 129 KB

english, 1990

63

Properties of continuous analog estimators for a discrete reliability-growth model : Gouri K. Bhattacharyya, Arthur Fries and Richard A. Johnson. IEEE Trans. Reliab.38(3), 373 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 129 KB

english, 1990

64

Bounds for the probability of failure resulting from stress/strength interference : Brian J. Melloy and Tom M. Cavalier. IEEE Trans. Reliab.38(3), 383 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 129 KB

english, 1990

65

Evaluation of system reliability with common-cause failures, by a pseudo-environments model : John Yuan, Min-Tsai Lai and Kai-Li Ko. IEEE Trans. Reliab.38(3), 328 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 259 KB

english, 1990

66

On estimating parameters in a discrete Weibull distribution : M. S. Ali Khan, A. Khalique and A. M. Abouammoh. IEEE Trans. Reliab.38(3), 348 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

67

A generalized fault simulator for combinational logic circuits : Arajesh Raina and T. N. Rajashekhara. Comput. elect. Engng15(3/4), 89 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

68

The Bayes predictive approach in reliability theory : C. A. Clarotti and F. Spizzichino. IEEE Trans. Reliab.38(3), 379 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

69

Smaller sums of disjoint products by subproduct inversion : Klaus D. Heidtmann. IEEE Trans. Reliab.38(3), 305 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

70

A new class of bathtub-shaped hazard rates and its application in a comparison of two test-statistics : Harald Kunitz. IEEE Trans. Reliab.38(3), 351 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

71

Availability of CNC machines: multiple-input transfer-function modeling : Yash P. Gupta and Toni M. Somers. IEEE Trans. Reliab.38(3), 285 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

72

Case study: reliability of the INEL-site power system : W. J. Galyean, R. D. Fowler, J. A. Close and M. E. Donley. IEEE Trans. Reliab.38(3), 279 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 257 KB

english, 1990

73

Availability calculations with exhaustible spares : Alan Wood. IEEE Trans. Reliab.38(3), 388 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 125 KB

english, 1990

74

A decomposition scheme for the analysis of fault trees and other combinatorial circuits : Paul Helman and Arnon Rosenthal. IEEE Trans. Reliab.38(3), 312 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 125 KB

english, 1990

75

The number of failed components in a consecutive-k-out-of-n:F system: Stavros Papastravridis. IEEE Trans. Reliab.38(3), 338 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 125 KB

english, 1990

76

IC card/memory technology moves forward with standardization : Hideo Baba. J. Electron. Engng, Jpn, 61 (November 1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 125 KB

english, 1990

77

Materials for optoelectronics and photonic integrated circuits : I. D. Henning. Prog. Crystal Growth Charact.19, 1 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 125 KB

english, 1990

78

New device concepts: the implications for MOVPE : J. L. Beeby. Prog. Crystal Growth Charact.19, 107 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 125 KB

english, 1990

79

Japanese measuring instruments: a prospective on the future : J. Electron. Engng, Jpn, 28 (September 1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 125 KB

english, 1990

80

Half-pitch, SMT-compatible products highlighted : J. Electron. Engng, Jpn, 60 (October 1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 125 KB

english, 1990

81

IC sockets shifting to 25 mil lead pitch PQFPs : Hirokatsu Yaegashi. J. Electron. Engng, Jpn, 48 (October 1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 125 KB

english, 1990

82

Development of a new low-stress hyperred LED encapsulant : Renso J. M. Zwiers, Hendrik J. L Bressers, Berry Ouwehand and Dieter Baumann. IEEE Trans. Compon. Hybrids mfg Technol.12(3), 387 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 136 KB

english, 1990

83

The influence of moisture on surface properties and insulation characteristics of AIN substrates : Yasutoshi Kurihara, Tsuneo Endoh and Kazuji Yamada. IEEE Trans. Compon. Hybrids mfg Technol.12(3), 330 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 136 KB

english, 1990

84

Fluorine passivation of metal surface for self-cleaning semiconductor equipment : N. Miki, M. Maeno, K. Maruhashi, Y. Nakagawa and T. Ohmi. IEEE Trans. Semiconductor Mfg3(1), 1 (1990)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 136 KB

english, 1990

85

Highly reliable die attachment on polished GaAs surfaces using gold-tin eutectic alloy : Chin C. Lee and Goran S. Matijasevic. IEEE Trans. Compon. Hybrids mfg Technol.12(3), 406 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 136 KB

english, 1990

86

TEM techniques for two dimensional junction delineation in integrated circuits : A. Romano, J. Vanhellemont, J. R. Morante and W. Vandervorst. Micron Microscop. Acta20(2), 151 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 136 KB

english, 1990

87

Resistance modeling of periodically perforated mesh planes in multilayer packaging structures : Ruey-Beei Wu.IEEE Trans. Compon. Hybrids mfg Technol.12(3), 365 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 136 KB

english, 1990

88

Water sorption in epoxy thin films : Michael G. McMaster and David S. Soane. IEEE Trans. Compon. Hybrids mfg Technol.12(3), 373 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 265 KB

english, 1990

89

The high-frequency characteristics of tape automated bonding (TAB) interconnects : Stuart M. Wentworth, Dean P. Neikirk and Carl R. Brahce. IEEE Trans. Compon. Hybrids mfg Technol.12(3), 340 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

90

Overview of tape automated bonding technology : J. H. Lau, S. J. Erasmus and D. W. Rice. Circuit Wld16(2), 5 (1990)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

91

Desorption characteristics of isopropanol (IPA) and moisture from IPA vapor dried silicon wafers : H. Mishima, T. Ohmi, T. Mizuniwa and M. Abe. IEEE Trans. Semiconductor Mfg2(4), 121 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

92

Inhomogeneous structures of multilayer overlayers : Jian Yuan. Solid St. Commun.72(11), 1127 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

93

A robust production control policy for VLSI wafer fabrication : Sheldon X. C. Lou and Patrick W. Kager. IEEE Trans. SemiconductorMfg2(4), 159 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

94

PARSEC—process analysis with recipe support for etcher control : T. Budge, S. Craven, S. Duran, J. T. Pearson, R. Welch and M. Wossum. IEEE Trans. Semiconductor Mfg3(1), 28 (1990)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

95

“Smart” integrated circuit processing : Chi-Yung Fu, Norman H. Chang and Kuang-Kuo Lin. IEEE Trans. Semiconductor Mfg2(4), 151 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

96

LCD technology allows panels to move closer to CRT quality : Koji Takahashi. J. Electron. Engng., Jpn, 86 (September 1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

97

Wafer-level system integration: a review : S. K. Tewksbury and L. A. Hornak. IEEE Circuits Devices Mag. 22 (September 1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

98

Subthreshold behaviour of silicon MESFETs on SOS and bulk silicon substrates : U. Magnusson, J. Tiren, H. Norde and H. Bleichner. Solid-St. Electron.32(11), 931 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

99

Process uniformity and slip dislocation patterns in linearly ramped-temperature transient rapid thermal processing of silicon : Mehrdad M. Moslehi. IEEE Trans. Semiconductor Mfg2(4), 130 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

100

Irregularity of film resistivity in a contact interface and contact conductance : Mitsunobu Nakamura. IEEE Trans. Compon. Hybrids mfg Technol.12(3), 393 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

101

On the mechanism of sputtering of SiO2 by Ar at ion energies near the sputtering threshold : S. S. Todorov and I. R. Chakarov. Vacuum39(11/12), 1101 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

102

Carrier transport simulator for silicon based on carrier distribution function evolutions : Takahiro Iizuka and Masao Fukuma. Solid-St. Electron.33(1) 27 (1990)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 132 KB

english, 1990

103

Energy-gap change in silicon n-type inversion layers at low temperature: R. B. M. Girisch, R. P. Mertens and O. B. Verbeke. Solid-St. Electron.33(1), 85 (1990)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 261 KB

english, 1990

104

Growth and characterization of high-quality InP/Ga0.25In0.75As0.5P0.5 and InP/Ga0.17In0.83As0.35P0.65 grown by the LP-MOCVD technique : M. Defour, F. Ohmes, P. Maurel and M. Razeghi. Revue tech. Thomson-CSF, 20–21(3), 387 (1989) (in French)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

105

Models and experiments on degradation of oxidized silicon : C. T. Sah. Solid-St. Electron.33(2), 147 (1990)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

106

Growth and characterisation of high-quality GaAs/Ga0.49In0.51P heterostructures grown by LP-MOCVD : F. Omes, M. Defour, P. Maurel and M. Razeghi. Revue tech. Thomson-CSF20–21(3), 407 (1989) (in French)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

107

Carrier multiplication and avalanche breakdown in selfaligned bipolar transistors : M. Reisch. Solid-St. Electron.33(2), 189 (1990)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

108

The model of growth kinetics of very thin thermal silicon oxide layer : Romuald B. Beck and Bogdan Majkusiak. Electron Technol. (Warsaw)21(1/2), 65 (1988)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

109

Hybrid IC technology leads to miniaturization : Mitsuharu Tsuchiya. J. Electron. Engng, Jpn, 84 (October 1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

110

New rules of resistance in small resistors : Vipin Srivastava. Solid St. Commun.73(8), 541 (1990)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 130 KB

english, 1990

111

New thick-film copper paste for ultra-fine line circuits : Toshio Ogawa Tadamichi Asai, Osamu Itoh, Mitorhu Hasegawa, Akira Ikegami, Kazuhiko Atoh and Takao Kobayashi. IEEE Trans. Compon Hybrids mfg Technol.12(3), 397 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 127 KB

english, 1990

112

Oxidation behaviour of AIN in the presence of oxide and glass for thick film applications : Takashi Yamagughi and Makiko Kageyama. IEEE Trans. Compon. Hybrids mfg Technol.12(3), 402 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 127 KB

english, 1990

113

Parasitic capacitance effects of planar resistors : Stefaan N. Demurie and Gilbert de Mey. IEEE Trans. Compon. Hybrids mfg Technol.12(3), 348 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 127 KB

english, 1990

114

Gate width effects on deep-level spectra in implanted GaAs MESFETs on LEC substrates : D. Bernal, A. Nogales, E. Calleja, E. Munoz and W. S. Lee. Solid-St. Electron.33(2), 243 (1990)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 127 KB

english, 1990

115

Study of low-energy hydrogen implantation in silicon : K. Srikanth and S. Ashok. Vacuum39(11/12), 1057 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 127 KB

english, 1990

116

Secondary ion mass spectrometry (SIMS) of silicon : M. Grasserbauer and G. Stingeder. Vacuum39(11/12), 1077 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 127 KB

english, 1990

117

Benefits of real-time, in situ particle monitoring in production medium current implantation : Peter G. Borden and Lawrence A. Larson. IEEE Trans. Semiconductor Mfg2(4), 141 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 127 KB

english, 1990

118

Broad-beam ion source technology and applications : Harold R. Kaufman and Raymond S. Robinson. Vacuum39(11/12), 1175 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 127 KB

english, 1990

119

Novel applications of ion implantation : C. Jeynes. Vacuum39(11/12), 1047 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 127 KB

english, 1990

120

Low temperature formation of silicon nitride and oxide films by the simultaneous use of a microwave ion source and an ICB source : J. Ishikawa, K. Matsugatani and G. Takaoka. Vaccum39(11/12), 1111 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 127 KB

english, 1990

121

The use of Hall effect profiling to monitor the reactivation of silicon implants after oxygen implantation in gallium arsenide : N. J. Whitehead, R. M. Gwilliam, W. F. Gillin and B. J. Sealy. Vacuum39(11/12), 1149 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 236 KB

english, 1990

122

A new multi-layer ion implantation model for process simulation : D. Pantic, S. Mijalkovic and N. Stojadinovic. Microelectron. J.20(6), 5 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 110 KB

english, 1990

123

Ion beam deposition of β-SiC layers onto α-SiC substrates : S. P. Withrow, K. L. More, R. A. Zuhr and T. E. Haynes. Vacuum39(11/12), 1065 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 110 KB

english, 1990

124

Lattice locations of erbium implants in silicon : Y. S. Tang, Zhang Jingping, K. C. Heasman and B. J. Sealy. Solid St. Commun.72(10), 991 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 110 KB

english, 1990

125

The development of ion implanter technology : D. Aitken. Vacuum39(11/12), 1025 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 110 KB

english, 1990

126

An improved silicon p-channel MESFET with a BF2 implanted thin channel and ErSi2 gate: J. Tiren, U. Magnusson, M. Rosling, H. Bleichner and S. Berg. Solid-St. Electron.32(11), 993 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 110 KB

english, 1990

127

Enhanced electrical activation of Zn and Be implants in GaAs by the co-implantation of phosphorus : A. C. T. Tang, B. J. Sealy and A. A. Rezazadeh. Vacuum39(11/12), 1061 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 110 KB

english, 1990

128

Double implant low dose technique in analog IC fabrication : Sam L. Sundaram and Arvid C. Carlson. IEEE Trans. Semiconductor Mfg2(4), 146 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 110 KB

english, 1990

129

Temperature and electric field dependence of hopping transport in ion-implanted Si:As : Chen Gang, H. D. Koppen, R. W. van der Heijden, A. T. A. M. de Waele and H. M. Ginjsman. Solid St. Commun.72(2), 173 (1989)

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 110 KB

english, 1990

130

4851097 Apparatus for repairing a pattern film

Osamu Hattori, Anton Yasaka, Yoshitom Nakagawa, Mitsuyoshi Sato, Sumio Sasaki

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 82 KB

english, 1990

131

4851359 Method of producing an electrical resistor by implanting a semiconductor material with rare gas

Alain Boudou, Brian Doyle, Jean-Claud Marchetaux

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 82 KB

english, 1990

132

4855253 Test method for random defects in electronic microstructures

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 82 KB

english, 1990

133

4855672 Method and process for testing the reliability of integrated circuit (IC) chips and novel IC circuitry for accomplishing same

RobertW Shreeve

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 177 KB

english, 1990

134

4855867 Full panel electronic packaging structure

CharlesE Gazdik, DonaldG McBride, Donald Seraphim, PatrickA Toole

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 96 KB

english, 1990

135

4857826 Tester system for electrical power circuits terminated at an outlet plug receptacle

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 96 KB

english, 1990

136

4857835 Global event qualification system

Journal:

Microelectronics Reliability

Year:

1990

Language:

english

File:

PDF, 96 KB

english, 1990

137

4857838 Apparatus for testing electronic components, in particular IC's

Hans-Heinrich Willberg

Journal:

Microelectronics Reliability

Year:

1990

File:

PDF, 78 KB

1990

138

4858072 Interconnection system for integrated circuit chips

Journal:

Microelectronics Reliability

Year:

1990

File:

PDF, 78 KB

1990

139

4858192 Semiconductor memory device with redundancy circuit

Yuuichi Tatsumi, Hidenobu Minagawa, Hiroshi Iwahashi, Masamichi Asano, Mizuho Imai

Journal:

Microelectronics Reliability

Year:

1990

File:

PDF, 78 KB

1990

140

4858208 Apparatus and method for testing semiconductor devices

Journal:

Microelectronics Reliability

Year:

1990

File:

PDF, 78 KB

1990