Volume 40; Issue 3

Microelectronics Reliability

Volume 40; Issue 3

1

An analytical comparison of the thermal performance of various ball grid array packaging technologies

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 4.42 MB

english, 2000

2

An overview to integrated power module design for high power electronics packaging

A.B. Lostetter, F. Barlow, A. Elshabini

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 2.35 MB

english, 2000

3

Thermal ink jet dynamics: modeling, simulation, and testing

Christian Rembe, Stefan aus der Wiesche, Eberhard P. Hofer

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 819 KB

english, 2000

4

A new reliability growth model: its mathematical comparison to the Duane model

John Donovan, Eamonn Murphy

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 176 KB

english, 2000

5

Low cost bumping by stencil printing: process qualification for 200 μm pitch

Joachim Kloeser, Katrin Heinricht, Erik Jung, Liane Lauter, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 1.38 MB

english, 2000

6

Mechanical properties of nanoscale copper under shear

P. Heino, E. Ristolainen

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 359 KB

english, 2000

7

Capacitance extraction of integrated-circuit interconnects by matrix decomposition based on MEI concept

Y.W. Liu, K. Lan, K.K. Mei

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 426 KB

english, 2000

8

Investigation of the thermal stress field in a multilevel aluminium metallisation in VLSI systems

P.M. Igic, P.A. Mawby

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 2.74 MB

english, 2000

9

THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards

Vladimı́r Székely, András Poppe, Márta Rencz, Miklós Rosental, Tamás Teszéri

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 600 KB

english, 2000

10

Transient electro-thermal simulation of microsystems with space-continuous thermal models in an analogue behavioural simulator

Mirko Jakovljevic, Zeljko Mrcarica, Peter A. Fotiu, Helmut Detter, Vanco Litovski

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 915 KB

english, 2000

11

A new application of acoustic micro imaging: screening MCM-C multilayer defects

G. Harsányi, J.E. Semmens, S.R. Martell

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 2.68 MB

english, 2000

12

Characterization of interfacial thermal resistance by acoustic micrography imaging

Shatil Haque, Guo-Quan Lu, J. Goings, J. Sigmund

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 1.79 MB

english, 2000

13

Thermal modelling of hybrid circuits: simulation method comparison

M. Janicki, A. Napieralski, D. Fedasyuk, D. Petrov

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 483 KB

english, 2000

14

Electrically active defects generated by MERIE and RIE-mode plasmas in thin SiO2-Si structures

E. Atanassova, A. Paskaleva

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 1.21 MB

english, 2000

15

Crossing point current of electron and proton irradiated power P-i-N diodes

J. Vobecký, P. Hazdra, O. Humbel, N. Galster

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 224 KB

english, 2000

16

Static and dynamic finite element modelling of thermal fatigue effects in insulated gate bipolar transistor modules

M.P. Rodriguez, N.Y.A. Shammas, A.T. Plumpton, D. Newcombe, D.E. Crees

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 1.06 MB

english, 2000