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Volume 42; Issue 8
Main
Microelectronics Reliability
Volume 42; Issue 8
Microelectronics Reliability
Volume 42; Issue 8
1
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature
Y.C Chan
,
D.Y Luk
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 1.02 MB
Your tags:
english, 2002
2
Testing process performance based on the yield: an application to the liquid-crystal display module
Jann-Pygn Chen
,
W.L. Pearn
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 193 KB
Your tags:
english, 2002
3
Searching for appropriate humidity accelerated migration reliability tests methods
P Bojta
,
P Németh
,
G Harsányi
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 347 KB
Your tags:
english, 2002
4
High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package
Huimin Xie
,
Anand Asundi
,
Chai Gin Boay
,
Lu Yunguang
,
Jin Yu
,
Zhong Zhaowei
,
Bryan K.A. Ngoi
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 369 KB
Your tags:
english, 2002
5
A novel simulation technique for testing analog ICs
M Dhifi
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 129 KB
Your tags:
english, 2002
6
Characterizations of GaN films grown with indium surfactant by RF-plasma assisted molecular beam epitaxy
W.K Fong
,
C.F Zhu
,
B.H Leung
,
C Surya
,
B Sundaravel
,
E.Z Luo
,
J.B Xu
,
I.H Wilson
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 120 KB
Your tags:
english, 2002
7
A review of reliability prediction methods for electronic devices
B Foucher
,
J Boullié
,
B Meslet
,
D Das
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 98 KB
Your tags:
english, 2002
8
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure
Y.C Chan
,
D.Y Luk
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 657 KB
Your tags:
english, 2002
9
No-flow underfill flip chip assembly––an experimental and modeling analysis
H Lu
,
K.C Hung
,
S Stoyanov
,
C Bailey
,
Y.C Chan
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 522 KB
Your tags:
english, 2002
10
In the memory of Georges Charitat
Marise Bafleur
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 42 KB
Your tags:
english, 2002
11
11th International Symposium on Silicon-on-Insulator Technology and Devices
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 25 KB
Your tags:
english, 2002
12
Calendar for forthcoming events
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 31 KB
Your tags:
english, 2002
13
Thermal Ta2O5––alternative to SiO2 for storage capacitor application
E Atanassova
,
D Spasov
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 569 KB
Your tags:
english, 2002
14
Study of the effect of reflow time and temperature on Cu–Sn intermetallic compound layer reliability
Wei Huang
,
James M Loman
,
Bülent Sener
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 196 KB
Your tags:
english, 2002
15
Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing
Leon Lantz
,
Seongdeok Hwang
,
Michael Pecht
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 143 KB
Your tags:
english, 2002
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