Volume 42; Issue 8

Microelectronics Reliability

Volume 42; Issue 8

1

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

Y.C Chan, D.Y Luk

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 1.02 MB

english, 2002

2

Testing process performance based on the yield: an application to the liquid-crystal display module

Jann-Pygn Chen, W.L. Pearn

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 193 KB

english, 2002

3

Searching for appropriate humidity accelerated migration reliability tests methods

P Bojta, P Németh, G Harsányi

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 347 KB

english, 2002

4

High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package

Huimin Xie, Anand Asundi, Chai Gin Boay, Lu Yunguang, Jin Yu, Zhong Zhaowei, Bryan K.A. Ngoi

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 369 KB

english, 2002

5

A novel simulation technique for testing analog ICs

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 129 KB

english, 2002

6

Characterizations of GaN films grown with indium surfactant by RF-plasma assisted molecular beam epitaxy

W.K Fong, C.F Zhu, B.H Leung, C Surya, B Sundaravel, E.Z Luo, J.B Xu, I.H Wilson

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 120 KB

english, 2002

7

A review of reliability prediction methods for electronic devices

B Foucher, J Boullié, B Meslet, D Das

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 98 KB

english, 2002

8

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure

Y.C Chan, D.Y Luk

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 657 KB

english, 2002

9

No-flow underfill flip chip assembly––an experimental and modeling analysis

H Lu, K.C Hung, S Stoyanov, C Bailey, Y.C Chan

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 522 KB

english, 2002

10

In the memory of Georges Charitat

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 42 KB

english, 2002

11

11th International Symposium on Silicon-on-Insulator Technology and Devices

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 25 KB

english, 2002

12

Calendar for forthcoming events

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 31 KB

english, 2002

13

Thermal Ta2O5––alternative to SiO2 for storage capacitor application

E Atanassova, D Spasov

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 569 KB

english, 2002

14

Study of the effect of reflow time and temperature on Cu–Sn intermetallic compound layer reliability

Wei Huang, James M Loman, Bülent Sener

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 196 KB

english, 2002

15

Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing

Leon Lantz, Seongdeok Hwang, Michael Pecht

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 143 KB

english, 2002