Volume 43; Issue 4

Microelectronics Reliability

Volume 43; Issue 4

1

A reliable procedure for testing linear regulators with one-sided specification limits based on multiple samples

W.L Pearn, G.H Lin

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 199 KB

english, 2003

2

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications

C.Y Yin, M.O Alam, Y.C Chan, C Bailey, Hua Lu

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 452 KB

english, 2003

3

Effects of hydrogenation on the performance and stability of p-channel polycrystalline silicon thin-film transistors

N.A. Hastas, C.A. Dimitriadis, F.V. Farmakis, G. Kamarinos

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 111 KB

english, 2003

4

A simple four-terminal small-signal model of RF MOSFETs and its parameter extraction

Minkyu Je, Jeonghu Han, Hyungcheol Shin, Kwyro Lee

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 221 KB

english, 2003

5

Electron transport in implant isolation GaAs layers

Z. Synowiec, B. Paszkiewicz

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 116 KB

english, 2003

6

Characterisation of series resistance degradation through charge pumping technique

S.K Manhas, D Chandra Sehkar, A.S Oates, M.M De Souza

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 304 KB

english, 2003

7

The quest for optimum technology of power semiconductor devices

Vitezslav Benda

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 31 KB

english, 2003

8

Present problems of power module packaging technology

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 263 KB

english, 2003

9

Dynamic avalanche and reliability of high voltage diodes

Josef Lutz, Martin Domeij

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 224 KB

english, 2003

10

Study of internal behavior in a vertical DMOS transistor under short high current stress by an interferometric mapping method

M. Blaho, D. Pogany, E. Gornik, M. Denison, G. Groos, M. Stecher

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 138 KB

english, 2003

11

Impact of the electron, proton and helium irradiation on the forward I–V characteristics of high-power P–i–N diode

J Vobecký, P Hazdra, V Záhlava

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 218 KB

english, 2003

12

MAGFET based current sensing for power integrated circuit

Giovanni Busatto, Roberto La Capruccia, Francesco Iannuzzo, Francesco Velardi, Roberto Roncella

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 474 KB

english, 2003

13

Study of aluminum thermomigration as a low thermal budget technique for innovative power devices

B Morillon, J.-M Dilhac, C Ganibal, C Anceau

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 215 KB

english, 2003

14

Copper metallization influence on power MOS reliability

Adeline Feybesse, Ivana Deram, Jean-Michel Reynes, Eric Moreau

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 244 KB

english, 2003

15

Oxynitride gate dielectric prepared by thermal oxidation of low-pressure chemical vapor deposition silicon-rich silicon nitride

Jackie Chan, Hei Wong, M.C. Poon, C.W. Kok

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 261 KB

english, 2003

16

System Design with System C; Thorsten Grotker, Stan Liao, Grant Martin, Stuart Swan. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp. 217, plus X, $110, ISBN 1-4020-7027-1

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 37 KB

english, 2003

17

Calendar of forthcoming events

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 43 KB

english, 2003

18

Diffusion and absorption of corrosive gases in electronic encapsulants

C Hillman, B Castillo, M Pecht

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 207 KB

english, 2003

19

Strength of Ta–Si interfaces by molecular dynamics

P. Heino, E. Ristolainen

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 119 KB

english, 2003

20

Low-frequency noise study in electron devices: review and update

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 247 KB

english, 2003

21

Experimental study of charge generation mechanisms in power MOSFETs due to energetic particle impact

F. Velardi, F. Iannuzzo, G. Busatto, J. Wyss, A. Candelori

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 269 KB

english, 2003

22

Transient effects on high voltage diode stack under reverse bias

V. Papež, B. Kojecký, J. Kožı́šek, J. Hejhal

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 179 KB

english, 2003

23

Onefold coordinated oxygen atom: an electron trap in the silicon oxide

V.A. Gritsenko, A.V. Shaposhnikov, Yu.N. Novikov, A.P. Baraban, Hei Wong, G.M. Zhidomirov, M. Roger

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 121 KB

english, 2003

24

Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp., Number of figures and tables 200, EURO 187.00/USD 185.00/GBP 120.00, ISBN 0-7923-7676-5

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 60 KB

english, 2003

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