Volume 18; Issue sup4

Road Materials and Pavement Design

Volume 18; Issue sup4

1

Using electrical resistance to evaluate the chip seal curing process

Montoya, Miguel A., Jason Weiss, W., Haddock, John E.

Journal:

Road Materials and Pavement Design

Year:

2017

Language:

english

File:

PDF, 2.30 MB

english, 2017

2

Impact of high recycled mixed on HMA overlay crack development rate

Al-Qadi, Imad L., Wu, Shenghua, Lippert, David L., Ozer, Hasan, Barry, Maxwell K., Safi, Fazal R.

Journal:

Road Materials and Pavement Design

Year:

2017

Language:

english

File:

PDF, 1.34 MB

english, 2017

3

Editorial

Daniel, Jo Sias, Richard Kim, Y., Roque, Reynaldo

Journal:

Road Materials and Pavement Design

Year:

2017

Language:

english

File:

PDF, 371 KB

english, 2017