Volume 14; Issue 1

Soldering & Surface Mount Technology

Volume 14; Issue 1

1

Optimisation modelling for flip‐chip solder joint reliability

Stoyanov, S., Bailey, C., Cross, M.

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 1004 KB

english, 2002

2

CFD modelling of the flow field inside a reflow oven

Yu, Hao, Kivilathti, Jorma

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 753 KB

english, 2002

3

Analysis on solder ball shear testing conditions with a simple computational model

Ricky Lee, S.W., Huang, Xingjia

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 512 KB

english, 2002

4

Numerical modelling of scanned beam laser soldering of fine pitch packages

Beckett, P.M., Fleming, A.R., Gilbert, J.M., Whitehead, D.G.

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 1.33 MB

english, 2002

5

Solder paste reflow modeling

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 286 KB

english, 2002

6

A simplified model of the reflow soldering process

Whalley, David C., Hyslop, Stuart M.

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 575 KB

english, 2002