IEEE Microwave Magazine

1

Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration

Fischer, Michael, Gropp, Sebastian, Stegner, Johannes, Frank, Astrid, Hoffmann, Martin, Mueller, Jens

Journal:

Year:

2019

Language:

english

File:

PDF, 5.23 MB

english, 2019

2

Circuit Modeling of Coaxial-Cable Baluns in Microstrip-Mounted, High-Power, Very-High-Frequency Amplifiers [Application Notes]

Radovanovic, Milos, Bukvic, Branko, Tasic, Sinisa, Ilic, Milan

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 2.32 MB

english, 2019

3

Enhancing RF Bulk Acoustic Wave Devices: Multiphysical Modeling and Performance

Chauhan, Vikrant, Huck, Christian, Frank, Astrid, Akstaller, Wolfgang, Weigel, Robert, Hagelauer, Amelie

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 3.07 MB

english, 2019

4

Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration

Fischer, Michael, Gropp, Sebastian, Stegner, Johannes, Frank, Astrid, Hoffmann, Martin, Mueller, Jens

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 5.23 MB

2019

5

Circuit Modeling of Coaxial-Cable Baluns in Microstrip-Mounted, High-Power, Very-High-Frequency Amplifiers [Application Notes]

Radovanovic, Milos, Bukvic, Branko, Tasic, Sinisa, Ilic, Milan

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 2.32 MB

2019

6

Enhancing RF Bulk Acoustic Wave Devices: Multiphysical Modeling and Performance

Chauhan, Vikrant, Huck, Christian, Frank, Astrid, Akstaller, Wolfgang, Weigel, Robert, Hagelauer, Amelie

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 3.07 MB

2019

7

MEMS-Based RF Oscillators Using SiCer Technology: New Integration, Packaging, and Assembly Concepts

Stegner, Johannes, Fischer, Michael, Gropp, Sebastian, Stehr, Uwe, Hein, Matthias A.

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 2.88 MB

english, 2019

8

Front Cover

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 2.70 MB

2019

9

Welcome to the October Issue [From the Editor's Desk]

Caverly, Robert H.

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 917 KB

english, 2019

10

Jimmy and Anne [MicroBusiness]

Schindler, Fred

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 243 KB

english, 2019

11

SiCer: Meeting the Challenges of Tomorrow's Complex Electronic Systems [From the Guest Editors' Desk]

Stehr, Uwe, Hagelauer, Amelie, Hein, Matthias A.

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 492 KB

english, 2019

12

When You Can't See What You're Looking For [Book/Software Reviews]

Riddle, Alfy

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 388 KB

english, 2019

13

The IEEE MTT-S 2019 International Microwave Biomedical Conference [Conference Report]

Hong, Hong, Zhang, Li, Chu, Hui, Che, Wenquan, Li, Changzhi, Zhu, Xiaohua

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 1.37 MB

english, 2019

14

A Passing to Note and an Update on MTT-S Technical Committees [President's Column]

Schreurs, Dominique

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 952 KB

english, 2019

15

Robert James Trew [In Memoriam]

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 195 KB

english, 2019

16

Wireless Power Week 2020

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 400 KB

2019

17

IMS2020

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 1.12 MB

2019

18

ImBioC 2020

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 436 KB

english, 2019

19

RWW 2020

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 222 KB

english, 2019

20

Front Cover

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 2.70 MB

2019

21

Welcome to the October Issue [From the Editor's Desk]

Caverly, Robert H.

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 917 KB

2019

22

Jimmy and Anne [MicroBusiness]

Schindler, Fred

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 243 KB

2019

23

SiCer: Meeting the Challenges of Tomorrow's Complex Electronic Systems [From the Guest Editors' Desk]

Stehr, Uwe, Hagelauer, Amelie, Hein, Matthias A.

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 492 KB

2019

24

When You Can't See What You're Looking For [Book/Software Reviews]

Riddle, Alfy

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 388 KB

2019

25

The IEEE MTT-S 2019 International Microwave Biomedical Conference [Conference Report]

Hong, Hong, Zhang, Li, Chu, Hui, Che, Wenquan, Li, Changzhi, Zhu, Xiaohua

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 1.37 MB

2019

26

A Passing to Note and an Update on MTT-S Technical Committees [President's Column]

Schreurs, Dominique

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 952 KB

2019

27

Robert James Trew [In Memoriam]

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 195 KB

2019

28

Wireless Power Week 2020

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 400 KB

2019

29

IMS2020

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 1.12 MB

2019

30

ImBioC 2020

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 436 KB

2019

31

RWW 2020

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 222 KB

2019

32

Staff List

Journal:

IEEE Microwave Magazine

Year:

2019

Language:

english

File:

PDF, 314 KB

english, 2019

34

Staff List

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 314 KB

2019

35

RF MEMS Modules: A Multiphysical Design Methodology Based on System Performance Requirements

Silva Cortes, Victor, Nowak, Jacek, Chauhan, Vikrant, Stehr, Uwe, Hein, Matthias A., Fischer, Georg, Hagelauer, Amelie

Journal:

IEEE Microwave Magazine

Year:

2019

File:

PDF, 2.17 MB

2019

Volume 20; Issue 10

Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration

Circuit Modeling of Coaxial-Cable Baluns in Microstrip-Mounted, High-Power, Very-High-Frequency Amplifiers [Application Notes]

Enhancing RF Bulk Acoustic Wave Devices: Multiphysical Modeling and Performance

Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration

Circuit Modeling of Coaxial-Cable Baluns in Microstrip-Mounted, High-Power, Very-High-Frequency Amplifiers [Application Notes]

Enhancing RF Bulk Acoustic Wave Devices: Multiphysical Modeling and Performance

MEMS-Based RF Oscillators Using SiCer Technology: New Integration, Packaging, and Assembly Concepts

Front Cover

Welcome to the October Issue [From the Editor's Desk]

Jimmy and Anne [MicroBusiness]

SiCer: Meeting the Challenges of Tomorrow's Complex Electronic Systems [From the Guest Editors' Desk]

When You Can't See What You're Looking For [Book/Software Reviews]

The IEEE MTT-S 2019 International Microwave Biomedical Conference [Conference Report]

A Passing to Note and an Update on MTT-S Technical Committees [President's Column]

Robert James Trew [In Memoriam]

Wireless Power Week 2020

IMS2020

ImBioC 2020

RWW 2020

Front Cover

Welcome to the October Issue [From the Editor's Desk]

Jimmy and Anne [MicroBusiness]

SiCer: Meeting the Challenges of Tomorrow's Complex Electronic Systems [From the Guest Editors' Desk]

When You Can't See What You're Looking For [Book/Software Reviews]

The IEEE MTT-S 2019 International Microwave Biomedical Conference [Conference Report]

A Passing to Note and an Update on MTT-S Technical Committees [President's Column]

Robert James Trew [In Memoriam]

Wireless Power Week 2020

IMS2020

ImBioC 2020

RWW 2020

Table of Contents

Staff List

Staff List

RF MEMS Modules: A Multiphysical Design Methodology Based on System Performance Requirements