Volume 28; Issue 2

Main
IEEE Transactions on Components and Packaging Technologies
Volume 28; Issue 2

IEEE Transactions on Components and Packaging Technologies

Volume 28; Issue 2

1

Thermal design and optimization of natural convection polymer pin fin heat sinks

Bahadur, R., Bar-Cohen, A.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 1.06 MB

english, 2005

2

A novel hybrid heat sink using phase change materials for transient thermal management of electronics

Krishnan, S., Garimella, S.V., Kang, S.S.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 659 KB

english, 2005

3

Optimization of pin-fin heat sinks using entropy generation minimization

Khan, W.A., Culham, J.R., Yovanovich, M.M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 550 KB

english, 2005

4

Four decades of research on thermal contact, gap, and joint resistance in microelectronics

Yovanovich, M.M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 1.15 MB

english, 2005

5

On one-dimensional analysis of thermoelectric modules (TEMs)

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 647 KB

english, 2005

6

Fins, fans, and form: volumetric limits to air-side heatsink performance

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 1.35 MB

english, 2005

7

Miniature loop heat pipes-a promising means for cooling electronics

Maydanik, Y.F., Vershinin, S.V., Korukov, M.A., Ochterbeck, J.M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 673 KB

english, 2005

8

Hierarchical thermal analysis of large IC modules

Celo, D., Xiao Ming Guo,, Gunupudi, P.K., Khazaka, R., Walkey, D.J., Smy, T., Nakhla, M.S.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 1.11 MB

english, 2005

9

Study of assembly processes for liquid crystal on silicon (LCoS) microdisplays

Choubey, A., Andros, F., Sammakia, B.G.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 626 KB

english, 2005

10

Adhesion improvement of thermoplastic isotropically conductive adhesive

Liong, S., Wong, C.P., Burgoyne, W.F.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 1.34 MB

english, 2005

11

Rheology based modeling and design of particle laden polymeric thermal interface materials

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 353 KB

english, 2005

12

Sensor technology roadmapping efforts at iNEMI

Richardson, C.E., Roop, R.M., Hendry, S., Azarian, M.H., Ganesan, S.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 581 KB

english, 2005

13

Thin layer acoustic image interpretation and metrology for microelectronics using a broadband model

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 512 KB

english, 2005

14

Mitigation and analysis of arc faults in automotive DC networks

Schoepf, T.J., Naidu, M., Gopalakrishnan, S.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 1.38 MB

english, 2005

15

Flow time measurements for underfills in flip-chip packaging

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 372 KB

english, 2005

16

Foreword Special Issue of Components and Packaging Technologies With Contributions From ITherm 2004 Thermal Management Track

Ramakrishna, K., Sammakia, B.G., Culham, J.R., Joshi, Y.K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 398 KB

english, 2005

17

Mechanical, thermal, and electrical analysis of a compliant interconnect

Galloway, J., Syed, A., WonJoon Kang,, JinYoung Kim,, Cannis, J., Ka, Y., SeungMo Kim,, TaeSeong Kim,, GiSong Lee,, SangHyun Ryu,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 1.47 MB

english, 2005

18

Determination of thermal compact model via evolutionary genetic optimization method

Arunasalam, P., Seetharamu, K.N., Azid, I.A.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 384 KB

english, 2005

19

Open Forum Editorial

Pecht, M.G.M.G.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 150 KB

english, 2005