Volume 32; Issue 4

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IEEE Transactions on Computer-Aided Design of Integrated...
Volume 32; Issue 4

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volume 32; Issue 4

1

3-D Mesh-Based Optical Network-on-Chip for Multiprocessor System-on-Chip

Ye, Yaoyao, Xu, Jiang, Huang, Baihan, Wu, Xiaowen, Zhang, Wei, Wang, Xuan, Nikdast, Mahdi, Wang, Zhehui, Liu, Weichen, Wang, Zhe

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 12.03 MB

english, 2013

2

Test Clock Domain Optimization to Avoid Scan Shift Failure Due to Flip-Flop Simultaneous Triggering

Huang, Yu-Chiuan, Tsai, Min-Hong, Ding, Wei-Sheng, Li, James Chien-Mo, Chang, Ming-Tung, Tsai, Min-Hsiu, Tseng, Chih-Mou, Li, Hung-Chun

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 4.51 MB

english, 2013

3

A Built-In Self-Repair Scheme for 3-D RAMs With Interdie Redundancy

Chou, Che-Wei, Huang, Yu-Jen, Li, Jin-Fu

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 6.73 MB

english, 2013

4

A Statistical Framework for Post-Fabrication Oxide Breakdown Reliability Prediction and Management

Zhuo, Cheng, Sylvester, Dennis, Blaauw, David

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 9.59 MB

english, 2013

5

TSV-Aware Analytical Placement for 3-D IC Designs Based on a Novel Weighted-Average Wirelength Model

Hsu, Meng-Kai, Balabanov, Valeriy, Chang, Yao-Wen

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 13.04 MB

english, 2013

6

Modeling and Application of Multi-Port TSV Networks in 3-D IC

Yao, Wei, Pan, Siming, Achkir, Brice, Fan, Jun, He, Lei

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 6.47 MB

english, 2013

7

Pre-Bond Probing of Through-Silicon Vias in 3-D Stacked ICs

Noia, Brandon, Chakrabarty, Krishnendu

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 8.44 MB

english, 2013

8

Symbolic Matching and Constraint Generation for Systematic Comparison of Analog Circuits

Ferent, Cristian, Doboli, Alex

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 4.76 MB

english, 2013

9

Testing 3-D IC Through-Silicon-Vias (TSVs) by Direct Probing

Kandalaft, Nabeeh, Rashidzadeh, Rashid, Ahmadi, Majid

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 7.26 MB

english, 2013

10

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems society information

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 132 KB

english, 2013

11

A 3-D Split Manufacturing Approach to Trustworthy System Development

Valamehr, Jonathan, Sherwood, Timothy, Kastner, Ryan, Marangoni-Simonsen, David, Huffmire, Ted, Irvine, Cynthia, Levin, Timothy

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 428 KB

english, 2013

12

An Analytical Placement Framework for 3-D ICs and Its Extension on Thermal Awareness

Luo, Guojie, Shi, Yiyu, Cong, Jason

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 3.18 MB

english, 2013

13

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

Sabry, Mohamed M., Sridhar, Arvind, Meng, Jie, Coskun, Ayse K., Atienza, David

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 6.39 MB

english, 2013

14

On Effective Through-Silicon Via Repair for 3-D-Stacked ICs

Jiang, Li, Xu, Qiang, Eklow, Bill

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 9.67 MB

english, 2013

15

Exploration and Optimization of 3-D Integrated DRAM Subsystems

Weis, C., Loi, I., Benini, L., Wehn, N.

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 12.79 MB

english, 2013

16

Guest Editorial

Xie, Yuan, Loh, Gabriel

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 334 KB

english, 2013

17

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems information for authors

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 27 KB

english, 2013

18

Table of contents

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 99 KB

english, 2013

19

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems publication information

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 34 KB

english, 2013