Gutmann, Ronald J.: search on Z-Library

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51

3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces

Lu, Jian-Qiang, McMahon, J. Jay, Gutmann, Ronald J.

Journal:

MRS Proceedings

Year:

2008

Language:

english

File:

PDF, 824 KB

english, 2008

52

Characterization of 4H-SiC Epitaxial Layers by Microwave Photoconductivity Decay

Kumar, R.J., Losee, P.A., Li, Can Hua, Seiler, Joseph, Bhat, I., Chow, T.P., Borrego, J.M., Gutmann, Ronald J.

Journal:

Materials Science Forum

Year:

2005

Language:

english

File:

PDF, 324 KB

english, 2005

53

Voltage Handling Capability and Microwave Performance of a 4H-SiC MESFET - A Simulation Study

Khemka, V., Chow, T.P., Gutmann, Ronald J.

Journal:

Materials Science Forum

Year:

1998

File:

PDF, 318 KB

1998

54

Comparative Evaluation of Anode Layers on the Electrical Characteristics of High Voltage 4H-SiC PiN Diodes

Losee, P.A., Wang, Y., Li, Can Hua, Sharma, Santosh K., Bhat, I., Chow, T.P., Gutmann, Ronald J.

Journal:

Materials Science Forum

Year:

2009

Language:

english

File:

PDF, 501 KB

english, 2009

55

AIP Conference Proceedings [AIP Fourth NREL conference on thermophotovoltaic generation of electricity - Denver, Colorado (USA) (11-14 Oct 1998)] - RF photoreflectance characterization of binary and quasi-binary substrates and antimonide-based TPV devices

Saroop, Sudesh, Borrego, Jose M., Gutmann, Ronald J., Dutta, Partha S., Ostrogorsky, Aleksander G., Charache, Greg W.

Year:

1999

File:

PDF, 786 KB

1999

56

THREE-DIMENSIONAL INTEGRATION IN MICROELECTRONICS: MOTIVATION, PROCESSING, AND THERMOMECHANICAL MODELING

Cale, Timothy S., Lu, Jian-Qiang, Gutmann, Ronald J.

Journal:

Chemical Engineering Communications

Year:

2008

Language:

english

File:

PDF, 3.66 MB

english, 2008

57

A new data effort to inform career choices in biomedicine

Blank, Rebecca, Daniels, Ronald J., Gilliland, Gary, Gutmann, Amy, Hawgood, Samuel, Hrabowski, Freeman A., Pollack, Martha E., Price, Vincent, Reif, L. Rafael, Schlissel, Mark S.

Journal:

Year:

2017

Language:

english

File:

PDF, 375 KB

english, 2017

58

A feature scale model for chemical mechanical planarization of damascene structures

Ravi Saxena, Dipto G. Thakurta, Ronald J. Gutmann, William N. Gill

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 737 KB

english, 2004

59

[IEEE 19th European Microwave Conference, 1989 - London, UK (1989.10.4-1989.10.6)] 19th European Microwave Conference, 1989 - GaAs Mesfets and Related Monolithic Structures as Broadband Microwave Control Devices

Gutmann, Ronald J.

Year:

1989

Language:

english

File:

PDF, 8.11 MB

english, 1989

60

Exploration of the Scaling Limits of 3D Integration

Pozder, Scott, Jones, Robert, Adams, Vance, Li, Hui-Feng, Canonico, Michael, Zollner, Stefan, Lee, Sang Hwui, Gutmann, Ronald J., Lu, Jian-Qiang

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 209 KB

english, 2006

61

Synthesis of Model Alumina Slurries for Damascene Patterning of Copper

Lee, Byung-Chan, Duquette, David J., Gutmann, Ronald J.

Journal:

MRS Proceedings

Year:

2001

Language:

english

File:

PDF, 515 KB

english, 2001

62

Thermal stresses in 3D IC inter-wafer interconnects

Jing Zhang, Max O. Bloomfield, Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 668 KB

english, 2005

63

Low-Temperature PETEOS-to-PETEOS Wafer Bonding Using Titanium as Bonding Intermediate

Yu, Jian, Moore, Richard L., Lee, Sang Hwui, McMahon, J. Jay, Lu, Jian-Qiang, Gutmann, Ronald J.

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 369 KB

english, 2006

64

[Integrated Circuits and Systems] Wafer Level 3-D ICs Process Technology || Thermal Challenges of 3D ICs

Tan, Chuan Seng, Gutmann, Ronald J., Reif, L. Rafael

Year:

2008

Language:

english

File:

PDF, 1.52 MB

english, 2008

65

Preface

Shyam P. Murarka, Ronald J. Gutmann

Journal:

Materials Chemistry and Physics

Year:

1995

Language:

english

File:

PDF, 162 KB

english, 1995

66

Electrical Characteristics and Reliability of 4H-SiC PiN Diodes Fabricated on In-House Grown and Commercial Epitaxial Films

Losee, P.A., Li, Can Hua, Seiler, Joseph, Stahlbush, Robert E., Chow, T.P., Bhat, I., Gutmann, Ronald J.

Journal:

Materials Science Forum

Year:

2005

Language:

english

File:

PDF, 543 KB

english, 2005

67

[Integrated Circuits and Systems] Wafer Level 3-D ICs Process Technology || Monolithic 3D Integrated Circuits

Tan, Chuan Seng, Gutmann, Ronald J., Reif, L. Rafael

Year:

2008

Language:

english

File:

PDF, 1007 KB

english, 2008

68

Micro–computed Tomographic Analysis of Mandibular Second Molars with C-shaped Root Canals

Amoroso-Silva, Pablo Andrés, Ordinola-Zapata, Ronald, Duarte, Marco Antonio Hungaro, Gutmann, James L., del Carpio-Perochena, Aldo, Bramante, Clovis Monteiro, de Moraes, Ivaldo Gomes

Journal:

Journal of Endodontics

Year:

2015

Language:

english

File:

PDF, 1.28 MB

english, 2015

69

Low-Temperature Titanium-Based Wafer Bonding

Yu, Jian, Wang, Yinmin, Moore, Richard L., Lu, Jian-Qiang, Gutmann, Ronald J.

Journal:

Journal of The Electrochemical Society

Year:

2007

Language:

english

File:

PDF, 677 KB

english, 2007

70

Chemical Mechanical Planarization of Microelectronic Materials || TUNGSTEN CMP PROCESSES

Steigerwald, Joseph M., Murarka, Shyam P., Gutmann, Ronald J.

Year:

1997

Language:

english

File:

PDF, 2.32 MB

english, 1997

71

Chemical Mechanical Planarization of Microelectronic Materials || Appendix - Problem Sets

Steigerwald, Joseph M., Murarka, Shyam P., Gutmann, Ronald J.

Year:

1997

Language:

english

File:

PDF, 1.11 MB

english, 1997

72

Solar Power Satellites as a Class Design Project in the University

Gutmann, Ronald J.

Journal:

IEEE Transactions on Education

Year:

1981

Language:

english

File:

PDF, 2.65 MB

english, 1981

73

Recombination processes in doubly capped antimonide-based quaternary thin films

Saroop, Sudesh, Borrego, Jose M., Gutmann, Ronald J., Charache, Greg W., Wang, Christine A.

Journal:

Journal of Applied Physics

Year:

1999

Language:

english

File:

PDF, 398 KB

english, 1999

74

Chemical Mechanical Planarization of Microelectronic Materials || Index

Steigerwald, Joseph M., Murarka, Shyam P., Gutmann, Ronald J.

Year:

1997

Language:

english

File:

PDF, 435 KB

english, 1997

75

Inverse analysis of material removal data using a multiscale CMP model

Jongwon Seok, Andrew T. Kim, Cyriaque P. Sukam, Anurag Jindal, John A. Tichy, Ronald J. Gutmann, Timothy S. Cole

Journal:

Microelectronic Engineering

Year:

2003

Language:

english

File:

PDF, 618 KB

english, 2003

76

Three-Dimensional Chemical Mechanical Planarization Slurry Flow Model Based on Lubrication Theory

Thakurta, Dipto G., Borst, Christopher L., Schwendeman, Donald W., Gutmann, Ronald J., Gill, William N.

Journal:

Journal of The Electrochemical Society

Year:

2001

Language:

english

File:

PDF, 275 KB

english, 2001

77

Interface Properties of 4H-SiC/SiO2 with MOS Capacitors and FETs Annealed in O2, N2O, NO and CO2

Wang, W., Banerjee, S., Chow, T.P., Gutmann, Ronald J., Isaacs-Smith, Tamara, Williams, John R., Jones, Kenneth A., Lelis, Aivars J., Tipton, W., Scozzie, Skip, Agarwal, Anant

Journal:

Materials Science Forum

Year:

2004

Language:

english

File:

PDF, 211 KB

english, 2004

78

Comparison of 1kV Lateral RESURF MOSFETs in 4H-SiC and 6H-SiC

Banerjee, S., Chow, T.P., Gutmann, Ronald J.

Journal:

Materials Science Forum

Year:

2003

Language:

english

File:

PDF, 287 KB

english, 2003

79

Chemical Mechanical Planarization of Microelectronic Materials || Chemical Mechanical Planarization—An Introduction

Steigerwald, Joseph M., Murarka, Shyam P., Gutmann, Ronald J.

Year:

1997

Language:

english

File:

PDF, 1.35 MB

english, 1997

80

[IEEE PEC 07 - Twenty-Second Annual IEEE Applied Power Electronics Conference and Exposition - Anaheim, CA, USA (2007.02.25-2007.03.1)] APEC 07 - Twenty-Second Annual IEEE Applied Power Electronics Conference and Exposition - 3D Power Delivery for Microprocessors and High-Performance ASICs

Sun, Jian, Lu, Jian-Qiang, Giuliano, David, Chow, T. Paul, Gutmann, Ronald J.

Year:

2007

Language:

english

File:

PDF, 4.47 MB

english, 2007

81

Chemical Mechanical Planarization of Microelectronic Materials || Historical Motivations for CMP

Steigerwald, Joseph M., Murarka, Shyam P., Gutmann, Ronald J.

Year:

1997

Language:

english

File:

PDF, 1.73 MB

english, 1997

82

[IEEE 2007 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - Boston, MA, USA (2007.09.30-2007.10.2)] 2007 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - A 12-bit 65 MS/s Pipeline A/D Converter in 0.18 ¿m SiGe BiCMOS

Devarajan, Siddharth, Gutmann, Ronald J., Rose, Kenneth

Year:

2007

Language:

english

File:

PDF, 355 KB

english, 2007

83

Breakdown Voltage Improvement of 4H-SiC Schottky Diodes by a Thin Surface Implant

Khemka, V., Chatty, K., Chow, T.P., Gutmann, Ronald J.

Journal:

Materials Science Forum

Year:

2000

File:

PDF, 338 KB

2000

84

Viscoelastic Stress Relief in Patterned Silicon-on-Insulator Structures

Letavic, Theodore J., Maby, Edward W., Gutmann, Ronald J.

Journal:

MRS Proceedings

Year:

1988

Language:

english

File:

PDF, 394 KB

english, 1988

85

Fabrication of Air-Gaps Between Cu Interconnects for Low Intralevel k.

Bhusari, Dhananjay M., Wedlake, Michael D., Kohl, Paul A., Case, Carlye, Klemens, Fred P., Miner, John, Lee, Byung-Chan, Gutmann, Ronald J., Lee, J.J., Shick, Robert, Rhodes, L.

Journal:

MRS Proceedings

Year:

2000

Language:

english

File:

PDF, 1.37 MB

english, 2000

86

Chemical Mechanical Planarization of Microelectronic Materials || CMP Variables and Manipulations

Steigerwald, Joseph M., Murarka, Shyam P., Gutmann, Ronald J.

Year:

1997

Language:

english

File:

PDF, 917 KB

english, 1997

87

Application of RF Circuit Design Principles to Distributed Power Converters

Gutmann, Ronald J.

Journal:

IEEE Transactions on Industrial Electronics and Control Instrumentation

Year:

1980

Language:

english

File:

PDF, 5.74 MB

english, 1980

88

Critical Adhesion Energy of Benzocyclobutene-Bonded Wafers

Kwon, Yongchai, Seok, Jongwon, Lu, Jian-Qiang, Cale, Timothy S., Gutmann, Ronald J.

Journal:

Journal of The Electrochemical Society

Year:

2006

Language:

english

File:

PDF, 298 KB

english, 2006

89

Gallium Nitride Metal-Insulator-Semiconductor Capacitors Using Low-Pressure Chemical Vapor Deposited Oxides

Matocha, Kevin, Chow, T.P., Gutmann, Ronald J.

Journal:

Materials Science Forum

Year:

2002

File:

PDF, 274 KB

2002

90

Improving Switching Characteristics of 4H-SiC Junction Rectifiers Using Epitaxial and Implanted Anodes with Epitaxial Refill

Losee, P.A., Li, Can Hua, Kumar, R.J., Chow, T.P., Bhat, I., Gutmann, Ronald J., Stahlbush, Robert E.

Journal:

Materials Science Forum

Year:

2006

Language:

english

File:

PDF, 397 KB

english, 2006

91

Chemical Mechanical Planarization of Microelectronic Materials || Copper CMP

Steigerwald, Joseph M., Murarka, Shyam P., Gutmann, Ronald J.

Year:

1997

Language:

english

File:

PDF, 3.56 MB

english, 1997

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