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51

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Lead-free solder bumping process for high temperature automotive application

Teutsch, T., Blankenhorn, R.G., Zakel, E.

Year:

2003

Language:

english

File:

PDF, 464 KB

english, 2003

52

[IEEE 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium - La Jolla, CA, USA (12-14 Sept. 1994)] Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium - Fluxless flip chip assembly on rigid and flexible polymer substrates using the Au-Sn metallurgy

Zakel, E., Gwiasda, J., Kloeser, J., Eldring, J., Engelmann, G., Reichl, H.

Year:

1994

Language:

english

File:

PDF, 1.43 MB

english, 1994

53

[IEEE Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA (14-16 Oct. 1996)] Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium - Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps

Aschenbrenner, R., Ostmann, A., Motulla, G., Zakel, E., Reichl, H.

Year:

1996

Language:

english

File:

PDF, 1.15 MB

english, 1996

54

[IEEE 1992 42nd Electronic Components & Technology Conference - San Diego, CA, USA (18-20 May 1992)] 1992 Proceedings 42nd Electronic Components & Technology Conference - Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn system

Zakel, E., Reichl, H.

Year:

1992

Language:

english

File:

PDF, 928 KB

english, 1992

55

[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - Wafer level CSP using low cost electroless redistribution layer

Teutsch, T., Oppert, T., Zakel, E., Klusmann, E., Meyer, H., Schulz, R., Schulze, J.

Year:

2000

Language:

english

File:

PDF, 707 KB

english, 2000

56

[IEEE 12th International Electronic Manufacturing Technology Symposium - Mainz, Germany (April 1-3, 1992)] 12th International Electronic Manufacturing Technology Symposium - Investigations of tab outer lead contacts performed by thermode gang bonding and laser single point bonding

Zakel, E., Azdasht, G., Kruppa, P., Ralchl, H.

Year:

1992

Language:

english

File:

PDF, 709 KB

english, 1992

57

[IEEE 1995 Japan International Electronic Manufacturing Technology Symposium - Omiya, Japan (4-6 Dec. 1995)] Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium - Approaches to flip chip technology using electroless nickel-gold bumps

Kloeser, J., Ostmann, A., Aschenbrenner, R., Zakel, E., Reichl, H.

Year:

1996

Language:

english

File:

PDF, 1.20 MB

english, 1996

58

[IEEE 1995 Japan International Electronic Manufacturing Technology Symposium - Omiya, Japan (4-6 Dec. 1995)] Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium - Flip chip soldering and adhesive bonding on organic substrates

Jung, E., Aschenbrenner, R., Ostmann, A., Zakel, E., Reichl, H.

Year:

1996

Language:

english

File:

PDF, 885 KB

english, 1996

59

[IEEE 40th Conference on Electronic Components and Technology - Las Vegas, NV, USA (20-23 May 1990)] 40th Conference Proceedings on Electronic Components and Technology - Electroless deposition of bumps for TAB technology

Simon, J., Zakel, E., Reichl, H.

Year:

1990

Language:

english

File:

PDF, 732 KB

english, 1990

60

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - F/sup 2/-cPAC/sup TM/-a manufacturing process for a low cost CSP

Kasulke, P., Oppert, T., Zakel, E., Titerle, L.

Year:

1998

Language:

english

File:

PDF, 1.58 MB

english, 1998

61

[IEEE 1995 Japan International Electronic Manufacturing Technology Symposium - Omiya, Japan (4-6 Dec. 1995)] Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium - The use of the FPC-laser method for different chip interconnection techniques

Azdasht, G., Kasulke, P., Zakel, E., Reichl, H.

Year:

1996

Language:

english

File:

PDF, 1.03 MB

english, 1996

62

[IEEE 2005 Conference on Lasers and Electro-Optics (CLEO) - Baltimore, MD, USA (2005.05.27-2005.05.27)] (CLEO). Conference on Lasers and Electro-Optics, 2005. - High-power, rapidly-tunable ZnGeP/sub 2/ intracavity optical parametric oscillator

Zakel, A., Wagner, J., Alford, W.J., Carrig, J.

Year:

2005

Language:

english

File:

PDF, 1.13 MB

english, 2005

63

[IEEE 1995 Proceedings. 45th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 1995)] 1995 Proceedings. 45th Electronic Components and Technology Conference - Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates

Kloeser, J., Zakel, E., Bechtold, F., Reichl, H.

Year:

1995

Language:

english

File:

PDF, 2.16 MB

english, 1995

64

[Opt. Soc. America Technical Digest. Summaries of papers presented at the Conference on Lasers and Electro-Optics. Conference Edition - Long Beach, CA, USA (19-24 May 2002)] Summaries of Papers Presented at the Lasers and Electro-Optics. CLEO '02. Technical Diges - Optical parametric oscillator based on cadmium germanium arsenide

Zakel, A., Setzler, S.D., Shunemann, P.G., Pollak, T.M., Burky, M., Guha, S.

Year:

2002

Language:

english

File:

PDF, 234 KB

english, 2002

65

[IEEE 1991 41st Electronic Components & Technology Conference - Atlanta, GA, USA (11-16 May 1991)] 1991 Proceedings 41st Electronic Components & Technology Conference - Investigations of laser soldered TAB inner lead contacts

Zakel, E., Azdasht, G., Reichl, H.

Year:

1991

Language:

english

File:

PDF, 1.07 MB

english, 1991

66

[IEEE 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Penang, Malaysia (2008.11.4-2008.11.6)] 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - WLCSP and Flip Chip bumping technologies

Strandjord, Andrew, Teutsch, Thorsten, Scheffler, Axel, Oppert, Thomas, Azdasht, Ghassem, Zakel, Elke

Year:

2008

Language:

english

File:

PDF, 350 KB

english, 2008

67

[IEEE IEEE International Symposium on Compound Semiconductors - San Diego, CA, USA (25-27 Aug. 2003)] 2003 International Symposium on Compound Semiconductors - Improvements in electrical and optical properties of low bandgap III-V antimonides by using isoelectronic dopants

Chandola, A., Youngok Ko,, Dutta, P.S., Zakel, A., Gonzalez, L., Hall, A., Henry, J., Gillen, G.D., Guha, S.

Year:

2003

Language:

english

File:

PDF, 104 KB

english, 2003

68

[IEEE 2005 IEEE LEOS Annual Meeting - Sydney, Australia (23-27 Oct. 2005)] 2005 IEEE LEOS Annual Meeting Conference Proceedings - Chromium-Doped Chalcogenide Lasers

Carrig, T.J., Zakel, A., Wagner, G.J., Alford, W.J.

Year:

2005

Language:

english

File:

PDF, 239 KB

english, 2005

69

[IEEE 40th Conference on Electronic Components and Technology - Las Vegas, NV, USA (20-23 May 1990)] 40th Conference Proceedings on Electronic Components and Technology - Investigations of failure mechanisms of TAB-bonded chips during thermal aging

Zakel, E., Reichl, H.

Year:

1990

Language:

english

File:

PDF, 829 KB

english, 1990

70

[IEEE 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium - Petaling Jaya, Malaysia (2007.11.8-2007.11.10)] 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium - Wafer Bumping & Wafer Level Packaging for 300mm Wafer

Oppert, Thomas, Zakel, Elke, Teutsch, Thorsten

Year:

2006

Language:

english

File:

PDF, 134 KB

english, 2006

71

Irradiance and temperature dependence of the charge carrier lifetimes in bulk Hg[sub 0.6]Cd[sub 0.4]Te

Guha, Shekhar, Zakel, Andrew, Blackshire, James L., Krishnamurthy, Srinivasan

Journal:

Applied Physics Letters

Year:

2003

Language:

english

File:

PDF, 242 KB

english, 2003

72

Validation of isotope dilution surface-enhanced Raman scattering (IDSERS) as a higher order reference method for clinical measurands employing international comparison schemes

Zakel, Sabine, Wundrack, Stefan, O'Connor, Gavin, Güttler, Bernd, Stosch, Rainer

Journal:

Journal of Raman Spectroscopy

Year:

2013

Language:

english

File:

PDF, 670 KB

english, 2013

73

[IEEE 2003 International Symposium on Compound Semiconductors: Post-Conference Proceedings - San Diego, CA, USA (25-27 Aug. 2003)] 2003 International Symposium on Compound Semiconductors: Post-Conference Proceedings (IEEE Cat. No.03TH8767) - Improvements in electrical and optical properties of low bandgap III-V antimonides by using isoelectronic dopants

Chandola, A., Youngok Ko,, Dutta, P.S., Zakel, A., Gonzales, L., Hall, A., Henry, J., Gillen, G.D., Guha, S.

Year:

2004

Language:

english

File:

PDF, 249 KB

english, 2004

74

[IEEE 2013 IEEE International Conference on Solid Dielectrics (ICSD) - Bologna, Italy (2013.06.30-2013.07.4)] 2013 IEEE International Conference on Solid Dielectrics (ICSD) - Ionic conductivities of calcium-phosphate glasses

Martin, J., Budina, D., Zakel, J., Schafer, M., Weitzel, K.-M.

Year:

2013

Language:

english

File:

PDF, 256 KB

english, 2013

75

[IEEE 1997 47th Electronic Components and Technology Conference - San Jose, CA, USA (18-21 May 1997)] 1997 Proceedings 47th Electronic Components and Technology Conference - Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

Kloeser, J., Heinricht, K., Kutner, K., Jung, E., Ostmann, A., Zakel, E., Reichl, H.

Year:

1997

Language:

english

File:

PDF, 1.42 MB

english, 1997

76

X-Ray Powder Diffraction Investigation of Ternary Au-Cu-Sn Alloys

Peplinski, B., Zakel, E.

Journal:

Materials Science Forum

Year:

1994

File:

PDF, 424 KB

1994

77

Infrared spectrometric measurement of impurities in highly enriched ‘Si28’

Zakel, S, Wundrack, S, Niemann, H, Rienitz, O, Schiel, D

Journal:

Year:

2011

Language:

english

File:

PDF, 330 KB

english, 2011

78

The lattice parameter of the 28 Si spheres in the determination of the Avogadro constant

Massa, E, Mana, G, Ferroglio, L, Kessler, E G, Schiel, D, Zakel, S

Journal:

Year:

2011

Language:

english

File:

PDF, 410 KB

english, 2011

79

[ECS ISTC/CSTIC 2009 (CISTC) - Shanghai, China (March 19 - March 20, 2009)] ECS Transactions - Electroless Nickel/Gold Under-Bump-Metallization Cost Comparisons

Strandjord, Andrew J., Scheffler, Axel, Zakel, Elke, Oppert, Thomas, Teutsch, Thorsten

Year:

2009

Language:

english

File:

PDF, 1.96 MB

english, 2009

80

Highways for ions in polymers - 3D–imaging of electrochemical interphase formation

Wesp, Veronika, Zakel, Julia, Schäfer, Martin, Paulus, Ilka, Greiner, Andreas, Weitzel, Karl-Michael

Journal:

Electrochimica Acta

Year:

2015

Language:

english

File:

PDF, 3.05 MB

english, 2015

81

SPIE Proceedings [SPIE Photonics Europe - Strasbourg, France (Monday 26 April 2004)] Solid State Lasers and Amplifiers - Chromium-doped chalcogenide lasers

Carrig, Timothy J., Wagner, Gregory J., Alford, William J., Zakel, Andrew, Sennaroglu, Alphan, Fujimoto, James G., Pollock, Clifford R.

Year:

2004

Language:

english

File:

PDF, 1.37 MB

english, 2004

82

SPIE Proceedings [SPIE SPIE LASE: Lasers and Applications in Science and Engineering - San Jose, CA (Saturday 24 January 2009)] Fiber Lasers VI: Technology, Systems, and Applications - Mid-IR super-continuum generation

Islam, Mohammed N., Xia, Chenan, Freeman, Mike J., Mauricio, Jeremiah, Zakel, Andy, Ke, Kevin, Xu, Zhao, Terry, Jr., Fred L., Gapontsev, Denis V., Kliner, Dahv A., Dawson, Jay W., Tankala, Kanishka

Year:

2009

Language:

english

File:

PDF, 4.53 MB

english, 2009

83

[IEEE 1997 47th Electronic Components and Technology Conference - San Jose, CA, USA (18-21 May 1997)] 1997 Proceedings 47th Electronic Components and Technology Conference - A new approach to chip size package using meniscus soldering and FPC-bonding

Kallmayer, C., Jung, E., Kasulke, P., Azadeh, R., Azdasht, G., Zakel, E., Reichl, H.

Year:

1997

Language:

english

File:

PDF, 766 KB

english, 1997

84

Prävalenz von Melanocortin-4-Rezeptor(MC4R)-Mutationen und Polymorphismen bei adipösen Kindern und Jugendlichen in einer konsekutiven pädiatrischen Inanspruchnahmepopulation

Zakel, U. A., Wudy, S. A., Heinzel-Gutenbrunner, M., Görg, T., Schäfer, H., Gortner, L., Blum, W. F., Hebebrand, J., Hinney, A.

Journal:

Klinische Pädiatrie

Year:

2005

File:

PDF, 469 KB

2005

85

[OSA Advanced Solid-State Photonics - Santa Fe, New Mexico (2004..-..)] Advanced Solid-State Photonics (TOPS) - High power Q-switched Tm:YALO lasers

Sullivan, Amy C., Zakel, Andrew, Wagner, Gregory J., Gwin, Douglas, Tiemann, Bruce, Stoneman, Robert C., Malm, Andrew I.R.

Year:

2004

Language:

english

File:

PDF, 337 KB

english, 2004

86

[OSA Advanced Solid-State Photonics - Vienna, Austria (2005..-..)] Advanced Solid-State Photonics (TOPS) - High-power, rapidly-tunable dual-band CdSe optical parametric oscillator

Zakel, Andrew, Wagner, Gregory J., Alford, William J., Carrig, Timothy J.

Year:

2005

Language:

english

File:

PDF, 858 KB

english, 2005

87

[OSA Advanced Solid-State Photonics - Vienna, Austria (2005..-..)] Advanced Solid-State Photonics - High-Power, Rapidly-Tunable Dual-Band CdSe Optical Parametric Oscillator

Zakel, Andrew, Wagner, Gregory J., Alford, William J., Carrig, Timothy J.

Year:

2005

Language:

english

File:

PDF, 604 KB

english, 2005

88

Traceable Quantitative Raman Microscopy and X-ray Fluorescence Analysis as Nondestructive Methods for the Characterization of Cu(In,Ga)Se2 Absorber Films

Zakel, S., Pollakowski, B., Streeck, C., Wundrack, S., Weber, A., Brunken, S., Mainz, R., Beckhoff, B., Stosch, R.

Journal:

Applied Spectroscopy

Year:

2016

Language:

english

File:

PDF, 1017 KB

english, 2016

89

[IEEE 1997 47th Electronic Components and Technology Conference - San Jose, CA, USA (18-21 May 1997)] 1997 Proceedings 47th Electronic Components and Technology Conference - Fluxless die bonding of high power laser bars using the AuSn-metallurgy

Weiss, S., Bader, V., Azdasht, G., Kasulke, P., Zakel, E., Reichl, H.

Year:

1997

Language:

english

File:

PDF, 1.08 MB

english, 1997

90

[IEEE International Symposium on Electronic Materials and Packaging (EMAP2000) - Hong Kong, China (30 Nov.-2 Dec. 2000)] International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) - Low cost flip chip bumping

Oppert, T., Teutsch, T., Zakel, E.

Year:

2000

Language:

english

File:

PDF, 758 KB

english, 2000

91

SPIE Proceedings [SPIE Symposium on Integrated Optics - San Jose, CA (Saturday 20 January 2001)] Photodetectors: Materials and Devices VI - Measurement of charge carrier decay rates in bulk indium arsenide and mercury cadmium telluride wafers

Guha, Shekhar, Blackshire, James L., Zakel, Andrew, Krishnamurthy, Srinivasan, Brown, Gail J., Razeghi, Manijeh

Year:

2001

Language:

english

File:

PDF, 258 KB

english, 2001

92

SPIE Proceedings [SPIE XXXIV Annual Symposium on Optical Materials for High Power Lasers: Boulder Damage Symposium - Boulder, CO (Monday 16 September 2002)] Laser-Induced Damage in Optical Materials: 2002 and 7th International Workshop on Laser Beam and Optics Characterization - Interferometric assessment of laser-induced damage to semiconductors

Blackshire, James L., Zakel, Andrew, Guha, Shekhar, Exarhos, Gregory J., Guenther, Arthur H., Kaiser, Norbert, Lewis, Keith L., Soileau, M. J., Stolz, Christopher J., Giesen, Adolf, Weber, Horst

Year:

2003

Language:

english

File:

PDF, 1.79 MB

english, 2003

93

Investigations of Laser Soldered TAB Inner Lead Contacts

Zakel, E., Azdasht, G., Reichl, H.

Journal:

Microelectronics International

Year:

1992

Language:

english

File:

PDF, 523 KB

english, 1992

94

Flip Chip Attach of Silicon and GaAs Fine Pitch Devices as well as Inner Lead TAB Attach Using Ball‐bump Technology

Eldring, J., Zakel, E., Reichl, H.

Journal:

Microelectronics International

Year:

1994

Language:

english

File:

PDF, 366 KB

english, 1994

95

SPIE Proceedings [SPIE Defense and Security Symposium - Orlando, Florida, USA (Monday 9 April 2007)] Laser Radar Technology and Applications XII - High-resolution 3D coherent laser radar imaging

Buck, Joseph, Turner, Monte D., Kamerman, Gary W., Malm, Andrew, Zakel, Andrew, Krause, Brian, Tiemann, Bruce

Year:

2007

Language:

english

File:

PDF, 2.86 MB

english, 2007

96

SPIE Proceedings [SPIE Optics/Photonics in Security and Defence - Florence, Italy (Monday 17 September 2007)] Electro-Optical Remote Sensing, Detection, and Photonic Technologies and Their Applications - Multi-function coherent ladar 3D imaging with S3

Buck, Joseph, Kamerman, Gary W., Steinvall, Ove K., Malm, Andrew, Zakel, Andrew, Lewis, Keith L., Krapels, Keith A., Krause, Brian, Tiemann, Bruce, Carrano, John C., Zukauskas, Arturas

Year:

2007

Language:

english

File:

PDF, 2.82 MB

english, 2007

97

Flip‐chip Bonding on Green Tape Ceramic Substrates

Zakel, E., Kloeser, J., Distler, H., Reichl, H.

Journal:

Microelectronics International

Year:

1993

Language:

english

File:

PDF, 464 KB

english, 1993

98

Competing K+- and Ca++-ion transport in calcium-potassium-phosphate-glasses

Mager, Anke, Menezes, Pramod V., Zakel, Julia, Schäfer, Martin, Weitzel, Karl-Michael

Journal:

Journal of Non-Crystalline Solids

Year:

2016

Language:

english

File:

PDF, 1009 KB

english, 2016

99

Comparison of potential higher order reference methods for total haemoglobin quantification—an interlaboratory study

Frank, Claudia, Brauckmann, Christine, Palos, Marie, Arsene, Cristian G., Neukammer, Joerg, del Castillo Busto, Maria Estela, Zakel, Sabine, Swart, Claudia, Güttler, Bernd, Stosch, Rainer

Journal:

Analytical and Bioanalytical Chemistry

Year:

2017

Language:

english

File:

PDF, 513 KB

english, 2017

100

Large O 2 Cluster Ions as Sputter Beam for ToF-SIMS Depth Profiling of Alkali Metals in Thin SiO 2 Films

Holzer, Sabine, Krivec, Stefan, Kayser, Sven, Zakel, Julia, Hutter, Herbert

Journal:

Analytical Chemistry

Year:

2017

Language:

english

File:

PDF, 845 KB

english, 2017