A method of water pretreatment to improve the thermal...

Microsystem Technologies 2012 / 04 Vol. 18; Iss. 4

A method of water pretreatment to improve the thermal bonding rate of PMMA microfluidic chip

Liqun Du, Hongling Chang, Mancang Song, Chong Liu
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Volume:
18
Language:
english
Pages:
6
DOI:
10.1007/s00542-012-1466-4
Date:
April, 2012
File:
PDF, 324 KB
english, 2012
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