Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging
Byung-Seung Yim, Yumi Kwon, Seung Hoon Oh, Jooheon Kim, Yong-Eui Shin, Seong Hyuk Lee, Jong-Min KimVolume:
52
Year:
2012
Language:
english
Pages:
1
DOI:
10.1016/j.microrel.2011.12.004
File:
PDF, 2.71 MB
english, 2012