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Volume 52; Issue 6
Main
Microelectronics Reliability
Volume 52; Issue 6
Microelectronics Reliability
Volume 52; Issue 6
1
New optimized Dual-Material (DM) gate design to improve the submicron GaN-MESFETs reliability in subthreshold regime
N. Lakhdar
,
F. Djeffal
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 355 KB
Your tags:
english, 2012
2
Experimental study of microrectangular groove structure covered with multi mesh layers on performance of flat plate heat pipe for LED lighting module
J.C. Hsieh
,
H.J. Huang
,
S.C. Shen
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.04 MB
Your tags:
english, 2012
3
Nvidia’s GPU failures: A case for prognostics and health management
Michael Pecht
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 181 KB
Your tags:
english, 2012
4
HMM–TLP correlation for system-efficient ESD design
Guido Notermans
,
Sergey Bychikhin
,
Dionyz Pogany
,
David Johnsson
,
Dejan Maksimovic
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.06 MB
Your tags:
english, 2012
5
Single event upset mitigation by means of a sequential circuit state freeze
Farouk Smith
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 726 KB
Your tags:
english, 2012
6
Analysis of reliability and optimization of ESD protection devices supported by modeling and simulation
A. Chvala
,
D. Donoval
,
P. Beno
,
J. Marek
,
P. Pribytny
,
M. Molnar
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.30 MB
Your tags:
english, 2012
7
On thermo-mechanical reliability of plated-through-hole (PTH)
Fei Su
,
Ronghai Mao
,
Ji Xiong
,
Kun Zhou
,
Zheng Zhang
,
Jiang Shao
,
Cunyi Xie
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.60 MB
Your tags:
english, 2012
8
Study of the breakdown failure mechanisms for power AlGaN/GaN HEMTs implemented using a RF compatible process
Gang Xie
,
Edward Xu
,
Bo Zhang
,
Wai Tung Ng
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.17 MB
Your tags:
english, 2012
9
Fault model for on-chip communication and joint equalization and special spacing rules for on-chip bus design
Lei Li
,
Jianhao Hu
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 512 KB
Your tags:
english, 2012
10
Radiation hardened by design techniques to reduce single event transient pulse width based on the physical mechanism
Jianjun Chen
,
Shuming Chen
,
Bin Liang
,
Biwei Liu
,
Fanyu Liu
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 875 KB
Your tags:
english, 2012
11
Study of intrinsic characteristics of ESD protection diodes for high-speed I/O applications
Chih-Ting Yeh
,
Ming-Dou Ker
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 2.78 MB
Your tags:
english, 2012
12
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging
Byung-Seung Yim
,
Yumi Kwon
,
Seung Hoon Oh
,
Jooheon Kim
,
Yong-Eui Shin
,
Seong Hyuk Lee
,
Jong-Min Kim
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 2.71 MB
Your tags:
english, 2012
13
Acceleration of the growth of Cu3Sn voids in solder joints
Peter Borgesen
,
Liang Yin
,
Pericles Kondos
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 857 KB
Your tags:
english, 2012
14
Economic design of the mean prognostic distance for canary-equipped electronic systems
Wenbin Wang
,
Shuxin Luo
,
Michael G. Pecht
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 379 KB
Your tags:
english, 2012
15
Challenges and developments of copper wire bonding technology
Peisheng Liu
,
Liangyu Tong
,
Jinlan Wang
,
Lei Shi
,
Hao Tang
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 690 KB
Your tags:
english, 2012
16
Effect of localised charges on nanoscale cylindrical surrounding gate MOSFET: Analog performance and linearity analysis
Rajni Gautam
,
Manoj Saxena
,
R.S. Gupta
,
Mridula Gupta
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 889 KB
Your tags:
english, 2012
17
A novel method to improve cell endurance window in source-side injection split gate flash memory
Yong-Shiuan Tsair
,
Yean-Kuen Fang
,
Feng-Renn Juang
,
Yu-Hsiung Wang
,
Wen-Ting Chu
,
Yung-Tao Lin
,
Luan Tran
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 596 KB
Your tags:
english, 2012
18
Yield enhancement techniques for 3-dimensional random access memories
Shyue-Kung Lu
,
Tin-Wei Chang
,
Han-Yu Hsu
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.11 MB
Your tags:
english, 2012
19
Determination of contact parameters of Ni/n-GaP Schottky contacts
S. Duman
,
K. Ejderha
,
Ö. Yiğit
,
A. Türüt
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 907 KB
Your tags:
english, 2012
20
Characterization and reliability of nMOSFETs on flexible substrates under mechanical strain
Hsuan-ling Kao
,
Chih-Sheng Yeh
,
Meng-Ting Chen
,
Hsien-Chin Chiu
,
Li-Chun Chang
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 822 KB
Your tags:
english, 2012
21
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)
Kyoung-Lim Suk
,
Kyosung Choo
,
Sung Jin Kim
,
Jong-Soo Kim
,
Kyung-Wook Paik
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.48 MB
Your tags:
english, 2012
22
Temperature dependent drain current model for Gate Stack Insulated Shallow Extension Silicon On Nothing (ISESON) MOSFET for wide operating temperature range
Vandana Kumari
,
Manoj Saxena
,
R.S. Gupta
,
Mridula Gupta
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.44 MB
Your tags:
english, 2012
23
A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages
Kyung-Woon Jang
,
Jin-Hyoung Park
,
Soon-Bok Lee
,
Kyung-Wook Paik
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.14 MB
Your tags:
english, 2012
24
Stress immunity enhancement of the SiN uniaxial strained n-channel metal–oxide–semiconductor field-effect-transistor by channel fluorine implantation
Yung-Yu Chen
,
Chih-Ren Hsieh
,
Fang-Yu Chiu
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 373 KB
Your tags:
english, 2012
25
Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation
Wenjing Zhang
,
Wei Luo
,
Anmin Hu
,
Ming Li
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.62 MB
Your tags:
english, 2012
26
Oxide and interface trap densities estimation in ultrathin W/La2O3/Si MOS capacitors
M. Mamatrishat
,
T. Kubota
,
T. Seki
,
K. Kakushima
,
P. Ahmet
,
K. Tsutsui
,
Y. Kataoka
,
A. Nishiyama
,
N. Sugii
,
K. Natori
,
T. Hattori
,
H. Iwai
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 392 KB
Your tags:
english, 2012
27
Efficient algorithms to accurately compute derating factors of digital circuits
Hossein Asadi
,
Mehdi B. Tahoori
,
Mahdi Fazeli
,
Seyed Ghassem Miremadi
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 964 KB
Your tags:
english, 2012
28
Investigation on the thermal behavior of 0.15 μm gate-length In0.4Al0.6As/In0.4Ga0.6As MHEMT
Che-Kai Lin
,
Hsien-Chin Chiu
,
Chao-Wei Lin
,
Hsuan-ling Kao
,
Feng-Tso Chien
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 673 KB
Your tags:
english, 2012
29
W doping effect on the dielectric properties of amorphous Ga2O3 films grown on Si substrate for low-k applications
A.A. Dakhel
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 679 KB
Your tags:
english, 2012
30
Modeling of noise for p-channel DG-FinFETs
Srabanti Pandit
,
Binit Syamal
,
C.K. Sarkar
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 422 KB
Your tags:
english, 2012
31
Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM
Tamás Hurtony
,
Attila Bonyár
,
Péter Gordon
,
Gábor Harsányi
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.57 MB
Your tags:
english, 2012
32
Low cost and highly reliable hardened latch design for nanoscale CMOS technology
Haiqing Nan
,
Ken Choi
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.28 MB
Your tags:
english, 2012
33
Modeling of SET seasoning effects in Phase Change Memory arrays
C. Zambelli
,
A. Chimenton
,
P. Olivo
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 512 KB
Your tags:
english, 2012
34
Variability aware low leakage reliable SRAM cell design technique
A. Islam
,
Mohd. Hasan
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 866 KB
Your tags:
english, 2012
35
Electrical failure analysis of peristaltic micropumps fabricated with PZT actuators
Bing-Liang Chen
,
Pao-Cheng Huang
,
Ling-Sheng Jang
,
Ming-Kun Chen
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 997 KB
Your tags:
english, 2012
36
Adaptive fault-tolerant DVFS with dynamic online AVF prediction
Farshad Firouzi
,
Ali Azarpeyvand
,
Mostafa E. Salehi
,
Sied Mehdi Fakhraie
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 2.45 MB
Your tags:
english, 2012
37
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method
Chun-Sean Lau
,
M.Z. Abdullah
,
F. Che Ani
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.15 MB
Your tags:
english, 2012
38
Uncertainty analysis of solder alloy material parameters estimation based on model calibration method
Jin Hyuk Gang
,
Dawn An
,
Jin Won Joo
,
Joo Ho Choi
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.57 MB
Your tags:
english, 2012
39
Inhomogeneous deformation and microstructure evolution of Sn–Ag-based solder interconnects during thermal cycling and shear testing
Hongtao Chen
,
Jing Han
,
Jue Li
,
Mingyu Li
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 3.12 MB
Your tags:
english, 2012
40
Physical properties and electrical characteristics of H2O-based and O3-based HfO2 films deposited by ALD
Jibin Fan
,
Hongxia Liu
,
Qianwei Kuang
,
Bo Gao
,
Fei Ma
,
Yue Hao
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 686 KB
Your tags:
english, 2012
41
Reflow discoloration formation on pure tin (Sn) surface finish
Xu Zeng
,
Hong-Qi Sun
,
Yan-Feng He
,
Xin-Ping Qu
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 741 KB
Your tags:
english, 2012
42
Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes
Hassen Medjahed
,
Paul-Etienne Vidal
,
Bertrand Nogarede
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.81 MB
Your tags:
english, 2012
43
Experiment study of dynamic looping process for thermosonic wire bonding
Fuliang Wang
,
Yun Chen
,
Lei Han
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.65 MB
Your tags:
english, 2012
44
Inside front cover - Editorial board
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 39 KB
Your tags:
english, 2012
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