Investigation of intermetallic compounds (IMCs) in...

Microelectronics Reliability 2012 Vol. 52; Iss. 6

Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM

Tamás Hurtony, Attila Bonyár, Péter Gordon, Gábor Harsányi
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Volume:
52
Year:
2012
Language:
english
Pages:
1
DOI:
10.1016/j.microrel.2011.12.035
File:
PDF, 1.57 MB
english, 2012
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