Thermo-mechanical stress of bonded wires used in high power...

Microelectronics Reliability 2012 Vol. 52; Iss. 6

Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes

Hassen Medjahed, Paul-Etienne Vidal, Bertrand Nogarede
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
52
Year:
2012
Language:
english
Pages:
1
DOI:
10.1016/j.microrel.2012.01.013
File:
PDF, 1.81 MB
english, 2012
Conversion to is in progress
Conversion to is failed