Evaluation of advanced chemical mechanical planarization...

Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnect

K.W. Chen, Y.L. Wang, C.P. Liu, Kevin Yang, L. Chang, K.Y. Lo, C.W. Liu
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Volume:
447-448
Year:
2004
Language:
english
Pages:
6
DOI:
10.1016/j.tsf.2003.07.015
File:
PDF, 153 KB
english, 2004
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