Using polydimethylsiloxane as a thermocurable resist for a soft imprint lithography process
L. Malaquin, F. Carcenac, C. Vieu, M. MauzacVolume:
61-62
Year:
2002
Language:
english
Pages:
6
DOI:
10.1016/s0167-9317(02)00573-7
File:
PDF, 637 KB
english, 2002