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A low thermal budget self-aligned Ti silicide technology using germanium implantation for thin-film SOI MOSFET's
Ping Liu, Hsiao, T.C., Woo, J.C.S.Volume:
45
Year:
1998
Language:
english
Pages:
7
DOI:
10.1109/16.678547
File:
PDF, 190 KB
english, 1998