Effects of thermal processes after silicidation on the...

IEEE Transactions on Electron Devices 1999 Vol. 46; Iss. 12

Effects of thermal processes after silicidation on the performance of TiSi2/polysilicon gate device

Se-Aug Jang, Tae-Kyun Kim, In-Seok Yeo, Hyeon-Soo Kim, Sahng-Kyoo Lee
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
46
Year:
1999
Language:
english
Pages:
4
DOI:
10.1109/16.808083
File:
PDF, 98 KB
english, 1999
Conversion to is in progress
Conversion to is failed