High-Density Through Silicon Vias for 3-D LSIs
Koyanagi, M., Fukushima, T., Tanaka, T.Volume:
97
Année:
2009
Langue:
english
Pages:
11
DOI:
10.1109/jproc.2008.2007463
Fichier:
PDF, 1.65 MB
english, 2009