Proceedings of the IEEE

1

IEEE Communications Society Launches New Certification Program in Wireless Communication Engineering Technologies [Point of View]

Desmond, C., Frantz, R.

Journal:

Year:

2009

Language:

english

File:

PDF, 134 KB

english, 2009

2

3-D Integration Technologies [Scanning the Issue]

Campardo, G., Ripamonti, G., Micheloni, R.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 158 KB

english, 2009

3

Electrical Engineering Hall of Fame: Frederick E. Terman [Scanning our Past]

Brittain, J. E.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 455 KB

english, 2009

4

SoC and SiP, the Yin and Yang of the Tao for the New Electronic Era

Maurelli, A., Belot, D., Campardo, G.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 662 KB

english, 2009

5

3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems

Jian-Qiang Lu

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 1.91 MB

english, 2009

6

3-D Stacked Package Technology and Trends

Carson, F.P., Young Cheol Kim, In Sang Yoon

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 3.00 MB

english, 2009

7

Through-Silicon Via (TSV)

Motoyoshi, M.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 1.06 MB

english, 2009

8

High-Density Through Silicon Vias for 3-D LSIs

Koyanagi, M., Fukushima, T., Tanaka, T.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 1.65 MB

english, 2009

9

System on Wafer: A New Silicon Concept in SiP

Poupon, G., Sillon, N., Henry, D., Gillot, C., Mathewson, A., Di Cioccio, L., Charlet, B., Leduc, P., Vinet, M., Batude, P.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 1.40 MB

english, 2009

10

A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages

Colombo, L., Paleari, D., Petrushin, A.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 758 KB

english, 2009

11

A Neural Network-Based Prediction Model in Embedded Processes of Gold Wire Bonding Structure for Stacked Die Package

Chin-Huang Chang, Yung-Hsiang Hung

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 1.62 MB

english, 2009

12

Signal Integrity Flow for System-in-Package and Package-on-Package Devices

Pulici, P., Vanalli, G.P., Dellutri, M.A., Guarnaccia, D., Lo Iacono, F., Campardo, G., Ripamonti, G.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 1.43 MB

english, 2009

13

3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot

Marchal, P., Bougard, B., Katti, G., Stucchi, M., Dehaene, W., Papanikolaou, A., Verkest, D., Swinnen, B., Beyne, E.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 1.32 MB

english, 2009

14

Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks

Jacob, P., Zia, A., Erdogan, O., Belemjian, P.M., Jin-Woo Kim, Chu, M., Kraft, R.P., McDonald, J.F., Bernstein, K.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 2.45 MB

english, 2009

15

Interconnect-Based Design Methodologies for Three-Dimensional Integrated Circuits

Pavlidis, V.F., Friedman, E.G.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 1.10 MB

english, 2009

16

System in Package Feasibility Process

Stoppino, P.P., Conci, A., Lessio, T., Ferrara, D.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 917 KB

english, 2009

17

Non-Volatile Memories for Removable Media

Micheloni, R., Picca, M., Amato, S., Schwalm, H., Scheppler, M., Commodaro, S.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 1.34 MB

english, 2009

18

3-D Data Storage, Power Delivery, and RF/Optical Transceiver—Case Studies of 3-D Integration From System Design Perspectives

Tong Zhang, Micheloni, R., Guoyan Zhang, Huang, Z.R., Jian-Qiang Lu, J.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 1.46 MB

english, 2009

19

Overview of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die CSPs

Zhong, Z.W., Tee, T.Y.

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 813 KB

english, 2009

20

[Front cover]

Journal:

Proceedings of the IEEE

Year:

2009

File:

PDF, 701 KB

2009

21

[Back cover]

Journal:

Proceedings of the IEEE

Year:

2009

File:

PDF, 433 KB

2009

22

IEEE Potentials is looking for article submissions

Journal:

Proceedings of the IEEE

Year:

2009

Language:

english

File:

PDF, 212 KB

english, 2009

23