Method for producing via-connections in semiconductor...

IEEE Transactions on Electron Devices 1983 Vol. 30; Iss. 10

Method for producing via-connections in semiconductor wafers using a combination of plasma and chemical etching

Guldan, A., Hrubcin, L., Kubek, J., Tykva, R.
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Volume:
30
Year:
1983
Language:
english
Pages:
2
DOI:
10.1109/t-ed.1983.21307
File:
PDF, 347 KB
english, 1983
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