Use of WNX as the diffusion barrier for interconnect copper...

IEEE Transactions on Electron Devices 2004 Vol. 51; Iss. 7

Use of WNX as the diffusion barrier for interconnect copper metallization of InGaP-GaAs HBTs

Shang-Wen Chang, Chang, E.Y., Cheng-Shih Lee, Ke-Shian Chen, Chao-Wei Tseng, Tung-Ling Hsieh
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Volume:
51
Year:
2004
Language:
english
Pages:
7
DOI:
10.1109/ted.2004.829862
File:
PDF, 371 KB
english, 2004
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