Compact physical IR-drop models for chip/package co-design...

IEEE Transactions on Electron Devices 2005 Vol. 52; Iss. 6

Compact physical IR-drop models for chip/package co-design of gigascale integration (GSI)

Shakeri, K., Meindl, J.D.
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Volume:
52
Year:
2005
Language:
english
Pages:
10
DOI:
10.1109/ted.2005.848125
File:
PDF, 717 KB
english, 2005
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