Vertical Integration of Stacked DRAM and High-Speed Logic...

IEEE Transactions on Advanced Packaging 2009 Vol. 32; Iss. 3

Vertical Integration of Stacked DRAM and High-Speed Logic Device Using SMAFTI Technology

Kurita, Y., Matsui, S., Takahashi, N., Soejima, K., Komuro, M., Itou, M., Kawano, M.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
32
Year:
2009
Language:
english
DOI:
10.1109/tadvp.2009.2015461
File:
PDF, 3.40 MB
english, 2009
Conversion to is in progress
Conversion to is failed