IEEE Transactions on Advanced Packaging

1

Enrichment of Package Antenna Approach With Dual Feeds, Guard Ring, and Fences of Vias

Zhang, Y.P.

Journal:

Year:

2009

Language:

english

File:

PDF, 891 KB

english, 2009

2

Electroplated Metal Buried Interconnect and Through-Wafer Metal-Filled Via Technology for High-Power Integrated Electronics

Chang-Hyeon Ji, Herrault, F., Hopper, P., Smeys, P., Johnson, P., Allen, M.G.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 2.32 MB

english, 2009

3

Improvement Potential and Equalization Example for Multidrop DRAM Memory Buses

Fredriksson, H., Svensson, C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 638 KB

english, 2009

4

Vertical Integration of Stacked DRAM and High-Speed Logic Device Using SMAFTI Technology

Kurita, Y., Matsui, S., Takahashi, N., Soejima, K., Komuro, M., Itou, M., Kawano, M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 3.40 MB

english, 2009

5

SnAg Microbumps for MEMS-Based 3-D Stacks

Johannessen, R., Taklo, M., Sunding, M.F.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 1.97 MB

english, 2009

6

Experimental and Numerical Characterization of Non-Fickian Moisture Diffusion in Electronic Packages

Celik, E., Guven, I., Madenci, E.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 881 KB

english, 2009

7

Novel Isotropical Conductive Adhesives for Electronic Packaging Application

Yu Tao, Yanping Xia, Hui Wang, Fanghong Gong, Haiping Wu, Guoliang Tao

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 832 KB

english, 2009

8

Thermomigration Versus Electromigration in Microelectronics Solder Joints

Abdulhamid, M.F., Basaran, C., Yi-Shao Lai

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 2.29 MB

english, 2009

9

Reduction in Reflections and Ground Bounce for Signal Line Over Slotted Power Plane Using Differential Coupled Microstrip Lines

Guang-Hwa Shiue, Ruey-Beei Wu

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 838 KB

english, 2009

10

High-Performance and Low-Cost 40-Gb/s CWDM Optical Modules

Min-Ching Lin, Tien-Tsorng Shih, Pei-Hao Tseng, Kuei-Ming Chu, Chieh Hu, Wood-Hi Cheng

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 1.68 MB

english, 2009

11

The Time Domain Propagator Method for Lossless Multiconductor Quasi-TEM Lines

Jaehoon Jeong, Ic-Pyo Hong, Nevels, R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 513 KB

english, 2009

12

A Novel Time-Domain Approach for Extracting Broadband Models of Power Delivery NetworksWith Resonance Effect

Chen-Chao Wang, Chih-Wen Kuo, Sung-Mao Wu, Hung-Hsiang Cheng, Chi-Tsung Chiu, Chih-Pin Hung

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 1.57 MB

english, 2009

13

Development of Optical MUX/DEMUX on Silicon Optical Bench—Assembly Accuracies

Chee-Wei Tan, Teck-Guan Lim, Jing Li, Endrio, T.G., Yi-Yoon Chai, Maruo, S., Ramana, P.V., Seung-Wook Yoon, Lau, J.H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 1.07 MB

english, 2009

14

Analytical Solutions for PCB Assembly Subjected to Mismatched Thermal Expansion

Wong, E.H., Kian-Meng Lim, Yiu-Wing Mai

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 985 KB

english, 2009

15

Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding Process

De-Shin Liu, Shu-Shen Yeh, Chun-Teh Kao, Hung-Che Shen, Geng-Shin Shen, Hung-Hsin Liu

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 2.34 MB

english, 2009

16