Analytical Solutions for PCB Assembly Subjected to...

IEEE Transactions on Advanced Packaging 2009 Vol. 32; Iss. 3

Analytical Solutions for PCB Assembly Subjected to Mismatched Thermal Expansion

Wong, E.H., Kian-Meng Lim, Yiu-Wing Mai
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
32
Year:
2009
Language:
english
DOI:
10.1109/tadvp.2009.2025222
File:
PDF, 985 KB
english, 2009
Conversion to is in progress
Conversion to is failed