Dynamics of Contact Wave in Silicon Wafer Direct Bonding

IEEE Transactions on Advanced Packaging 2010 Vol. 33; Iss. 2

Dynamics of Contact Wave in Silicon Wafer Direct Bonding

Guanglan Liao, Yuping Shi, Tielin Shi, Lei Nie
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Volume:
33
Year:
2010
Language:
english
DOI:
10.1109/tadvp.2009.2037730
File:
PDF, 673 KB
english, 2010
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