IEEE Transactions on Advanced Packaging

1

Parametric Macromodeling of Lossy and Dispersive Multiconductor Transmission Lines

Ferranti, F., Antonini, G., Dhaene, T., Knockaert, L.

Journal:

Year:

2010

Language:

english

File:

PDF, 1.29 MB

english, 2010

2

A Well-Conditioned Integral-Equation Formulation for Efficient Transient Analysis of Electrically Small Microelectronic Devices

Bagci, H., Andriulli, F.P., Vipiana, F., Vecchi, G., Michielssen, E.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1.70 MB

english, 2010

5

Simplified Delay Extraction-Based Passive Transmission Line Macromodeling Algorithm

Nakhla, N., Nakhla, M., Achar, R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 724 KB

english, 2010

6

Power-Bus Sensitivity Analysis

De Camillis, L., Antonini, G., Jandhyala, V.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1.20 MB

english, 2010

7

Finite-Difference Analysis of Interconnects With Frequency-Dependent Parameters Based on Equivalent Circuit Models

Min Tang, Junfa Mao

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 483 KB

english, 2010

8

Wafer Level Processing of Integrated Passive Components Using Polyimide or Polybenzoxazole/Copper Multilayer Technology

Zoschke, K., Fischer, T., Topper, M., Samulewicz, K., Wunsch, O., Roder, J., Lutz, M., Ehrmann, O., Reichl, H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1.93 MB

english, 2010

9

Correction to “Laser-Assisted Sealing and Testing for Ceramic Packaging of MEMS Devices” [Aug 03 283-288]

Tao, Y., Malshe, A. P., Brown, W. D., DeReus, D. R., Cunningham, S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 25 KB

english, 2010

10

Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics

Boping Wu, Leung Tsang

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 842 KB

english, 2010

11

Fast Iterative Solution Algorithms in the Frequency-Domain Layered Finite Element Method for Analyzing Integrated Circuits

Feng Sheng, Houle Gan, Dan Jiao

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 777 KB

english, 2010

12

On Simplified Fast Modal Analysis for Through Silicon Vias in Layered Media Based Upon Full-Wave Solutions

Zhonghai Guo, Guangwen Pan

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 911 KB

english, 2010

13

Distribution and Diffusion of Water in Model Epoxy Molding Compound: Molecular Dynamics Simulation Approach

Seung Geol Lee, Seung Soon Jang, Jongman Kim, Kim, G.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1.19 MB

english, 2010

14

Comments on "Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging

Yin, H.M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 87 KB

english, 2010

15

Development of Optical Subassembly for Plastic Optical Fiber Transceiver in High-Speed Applications

Jing Zhang, Ramana, P.V., Chandrappan, J., Chee Wei Tan, Yi Yoon Chai, Yee Mong Khoo, Wei Liang Teo, Shing, J.L.H., Gomex, P.O., Ting Wang, Ramkumar, V.M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 657 KB

english, 2010

16

Serpentine Microstrip Lines With Zero Far-End Crosstalk for Parallel High-Speed DRAM Interfaces

Kyoungho Lee, Hae-Kang Jung, Hyung-Joon Chi, Hye-Jung Kwon, Jae-Yoon Sim, Hong-June Park

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1.11 MB

english, 2010

17

Three-Dimensional Modelling to Study the Effect of Die-Stacking Shape on Mould Filling During Encapsulation of Microelectronic Chips

Abdullah, M.K., Abdullah, M.Z., Mujeebu, M.A., Ariff, Z.M., Ahmad, K.A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1.42 MB

english, 2010

18

Synthesis of High-Quality Vertically Aligned Carbon Nanotubes on Bulk Copper Substrate for Thermal Management

Wei Lin, Rongwei Zhang, Kyoung-Sik Moon, Wong, C.P.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1.35 MB

english, 2010

19

Sensitivity Analysis of Lossy Nonuniform Multiconductor Transmission Lines With Nonlinear Terminations

Lei Dou, Jiao Dou

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 307 KB

english, 2010

20

Lead-Free Solder Material and Chip Thickness Impact on Board-Level Reliability for Low-K WLCSP

Chen, K.M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 2.37 MB

english, 2010

21

Aligning Chips Face-to-Face for Dense Capacitive and Optical Communication

Cunningham, J.E., Krishnamoorthy, A.V., Shubin, I., Xuezhe Zheng, Asghari, M., Dazeng Feng, Mitchell, J.G.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1.70 MB

english, 2010

22

Dynamics of Contact Wave in Silicon Wafer Direct Bonding

Guanglan Liao, Yuping Shi, Tielin Shi, Lei Nie

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 673 KB

english, 2010

23

GaN-Based Power Flip-Chip LEDs With an Internal ESD Protection Diode on Cu Sub-Mount

Sun, Y.X., Chen, W.S., Hung, S.C., Lam, K.T., Liu, C.H., Shoou-Jinn Chang

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 621 KB

english, 2010

24

An Integration Technology for RF and Microwave Circuits Based on Interconnect Programming

Rabieirad, L., Martinez, E.J., Mohammadi, S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1011 KB

english, 2010

25

The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application

Chia-Yeh Yang, Yu-Ting Cheng, Wen-Syang Hsu

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 2.69 MB

english, 2010

26

Packaging of Dual-Mode Wireless Communication Module Using RF/Optoelectronic Devices With Shared Functional Components

Jun Liao, Juan Zeng, Shengling Deng, Boryssenko, A.O., Joyner, V.M., Huang, Z.R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1.69 MB

english, 2010

27

Collimated Aerosol Beam Deposition: Sub-5-m Resolution of Printed Actives and Passives

Schulz, D.L., Hoey, J.M., Thompson, D., Swenson, O.F., Han, S., Lovaasen, J., Dai, X., Braun, C., Keller, K., Akhatov, I.S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 567 KB

english, 2010

28

Probabilistic Design Approach for Cyclic Fatigue Life Prediction of Microelectronic Interconnects

Ladani, L.J., Razmi, J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1.30 MB

english, 2010

29

Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies

Wei Tan, Ume, I.C., Ying Hung, Wu, C.F.J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1.12 MB

english, 2010

30

Electrical Modeling and Design of a Wafer-Level Package for MEM Resonators

Perruisseau-Carrier, J., Mazza, M., Jourdain, A., Skrivervik, A.K., Ionescu, A.M., Tilmans, H.A.C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 800 KB

english, 2010

31

Design and Development of Fine Pitch Copper/Low-K Wafer Level Package

Rao, V.S., Xiaowu Zhang, Ho Soon Wee, Rajoo, R., Premachandran, C.S., Kripesh, V., Seung Wook Yoon, Lau, J.H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 2.09 MB

english, 2010

32

Electronic Packaging Materials for Extreme, Low Temperature, Fatigue Environments

Shapiro, A.A., Tudryn, C., Schatzel, D., Tseng, S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 4.18 MB

english, 2010

33

Compact LTCC Rat-Race Couplers Using Multilayered Phase-Delay and Phase-Advance T-Equivalent Sections

Chao-Hsiung Tseng

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 945 KB

english, 2010

34