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Packaging of Dual-Mode Wireless Communication Module Using RF/Optoelectronic Devices With Shared Functional Components
Jun Liao, Juan Zeng, Shengling Deng, Boryssenko, A.O., Joyner, V.M., Huang, Z.R.Volume:
33
Year:
2010
Language:
english
DOI:
10.1109/tadvp.2009.2038359
File:
PDF, 1.69 MB
english, 2010