Packaging of Dual-Mode Wireless Communication Module Using...

IEEE Transactions on Advanced Packaging 2010 Vol. 33; Iss. 2

Packaging of Dual-Mode Wireless Communication Module Using RF/Optoelectronic Devices With Shared Functional Components

Jun Liao, Juan Zeng, Shengling Deng, Boryssenko, A.O., Joyner, V.M., Huang, Z.R.
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Volume:
33
Year:
2010
Language:
english
DOI:
10.1109/tadvp.2009.2038359
File:
PDF, 1.69 MB
english, 2010
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