Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile
Wang, Tong Hong, Tsai, Ching-I, Lee, Chang-Chi, Lai, Yi-ShaoVolume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2012.08.006
Date:
February, 2013
File:
PDF, 2.13 MB
english, 2013