Volume 53; Issue 2

Microelectronics Reliability

Volume 53; Issue 2

1

Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile

Wang, Tong Hong, Tsai, Ching-I, Lee, Chang-Chi, Lai, Yi-Shao

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.13 MB

english, 2013

2

Interdiffusion at the interface between Sn-based solders and Cu substrate

Yang, Yang, Li, Yongzhi, Lu, Hao, Yu, Chun, Chen, Junmei

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.05 MB

english, 2013

3

Bias dependence of TID radiation responses of 0.13μm partially depleted SOI NMOSFETs

Ning, Bingxu, Bi, Dawei, Huang, Huixiang, Zhang, Zhengxuan, Hu, Zhiyuan, Chen, Ming, Zou, Shichang

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.03 MB

english, 2013

4

Numerical analysis of localised charges impact on static and dynamic performance of nanoscale cylindrical surrounding gate MOSFET based CMOS inverter

Gautam, Rajni, Saxena, Manoj, Gupta, R.S., Gupta, Mridula

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1014 KB

english, 2013

5

Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging

Khor, C.Y., Abdullah, M.Z.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.99 MB

english, 2013

6

Acceleration factor for ageing measurement of dye solar cells

Ciammaruchi, Laura, Penna, Stefano, Reale, Andrea, Brown, Thomas M., Di Carlo, Aldo

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 351 KB

english, 2013

7

PMOS-based power-rail ESD clamp circuit with adjustable holding voltage controlled by ESD detection circuit

Yeh, Chih-Ting, Ker, Ming-Dou

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.21 MB

english, 2013

8

An on-chip sensor to measure and compensate static NBTI-induced degradation in analog circuits

Askari, Syed, Nourani, Mehrdad

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 966 KB

english, 2013

9

Estimation and visualization of the fatigue life of Pb-free SAC solder bump joints under thermal cycling

Tohmyoh, Hironori, Ishikawa, Shoho, Watanabe, Satoshi, Kuroha, Motohisa, Nakano, Yoshikatsu

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 929 KB

english, 2013

10

Building-up of system level ESD modeling: Impact of a decoupling capacitance on ESD propagation

Monnereau, N., Caignet, F., Trémouilles, D., Nolhier, N., Bafleur, M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.53 MB

english, 2013

11

Pitfalls for CDM calibration procedures

Smedes, T., Polewski, M., van IJzerloo, A., Lefebvre, J.L., Dekker, M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 999 KB

english, 2013

12

Experimental evaluation of hot electron reliability on differential Clapp-VCO

Jang, S.L., Yuan, J.S., Yen, S.D., Kritchanchai, E., Huang, G.W.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 689 KB

english, 2013

13

Electrostatic discharge (ESD) protection of N-type silicon controlled rectifier with P-type MOSFET pass structure for high voltage operating I/O application

Kim, Kil-Ho, Seo, Yong-Jin

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 373 KB

english, 2013

14

Investigation of gate voltage oscillations in an IGBT module after partial bond wires lift-off

Zhou, Luowei, Zhou, Shengqi, Xu, Mingwei

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.08 MB

english, 2013

15

Inside front cover - Editorial board

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 36 KB

english, 2013

16

HBM tester waveforms, equivalent circuits, and socket capacitance

Maloney, Timothy J.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 535 KB

english, 2013

17

Secondary ESD clamp circuit for CDM protection of over 6Gbit/s SerDes application in 40nm CMOS

Okushima, Mototsugu, Tsuruta, Junji

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 862 KB

english, 2013

18

The wire sag problem in wire bonding technology for semiconductor packaging

Kung, Huang-Kuang, Chen, Hung-Shyong, Lu, Ming-Cheng

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.08 MB

english, 2013

19

The impact of interface/border defect on performance and reliability of high-k/metal-gate CMOSFET

Yeh, Wen-Kuan, Chen, Po-Ying, Gan, Kwang-Jow, Wang, Jer-Chyi, Lai, Chao Sung

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 921 KB

english, 2013

20

Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn–3.5Ag solder bumps

Zhao, Qinghua, Hu, Anmin, Li, Ming, Sun, Jiangyan

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.29 MB

english, 2013

21

vfTLP-VTH: A new method for quantifying the effectiveness of ESD protection for the CDM classification test

Zhou, Yuanzhong, Ellis, David, Hajjar, Jean-Jacques, Olney, Andrew, Liou, Juin J.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 985 KB

english, 2013

22

Voltage and current stress induced variations in TiN/HfSixOy/TiN MIM capacitors

Misra, D., Kasinath, Jyothi, Chandorkar, Arun N.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 782 KB

english, 2013

23

Advances in ESD protection for ICs

Vassilev, Vesselin

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 107 KB

english, 2013

24

Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32nm and beyond

Fiori, Vincent, Gallois-Garreignot, Sébastien, Jaouen, Hervé, Tavernier, Clément

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.64 MB

english, 2013

25

Effects of ‘Latent Damage’ on pad cratering: Reduction in life and a potential change in failure mode

Raghavan, Venkatesh Arasanipalai, Roggeman, Brian, Meilunas, Michael, Borgesen, Peter

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.92 MB

english, 2013