Filling of nanoscale holes with high aspect ratio by Cu...

Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles

Shinoda, Nao, Shimizu, Tetsuya, Chang, Tso-Fu Mark, Shibata, Akinobu, Sone, Masato
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Volume:
97
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2012.02.031
Date:
September, 2012
File:
PDF, 731 KB
english, 2012
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