Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles
Shinoda, Nao, Shimizu, Tetsuya, Chang, Tso-Fu Mark, Shibata, Akinobu, Sone, MasatoVolume:
97
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2012.02.031
Date:
September, 2012
File:
PDF, 731 KB
english, 2012