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Laser-assisted ultrathin die packaging: Insights from a process study
Val R. Marinov, Orven Swenson, Yuriy Atanasov, Nathan SchneckVolume:
101
Year:
2013
Language:
english
DOI:
10.1016/j.mee.2012.08.016
File:
PDF, 856 KB
english, 2013