Defect detection of flip-chip solder joints using modal...

Microelectronics Reliability 2012 Vol. 52; Iss. 12

Defect detection of flip-chip solder joints using modal analysis

Junchao Liu, Tielin Shi, Ke Wang, Zirong Tang, Guanglan Liao
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Volume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.06.135
File:
PDF, 1.97 MB
english, 2012
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