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Volume 52; Issue 12
Main
Microelectronics Reliability
Volume 52; Issue 12
Microelectronics Reliability
Volume 52; Issue 12
1
Simulation model and parameter extraction of Field-Stop (FS) IGBT
Yong Tang
,
Bo Wang
,
Ming Chen
,
Binli Liu
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 2.01 MB
Your tags:
english, 2012
2
High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height
Emeka H. Amalu
,
N.N. Ekere
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 3.04 MB
Your tags:
english, 2012
3
Electro- and thermo-migration induced failure mechanisms in Package on Package
L. Meinshausen
,
K. Weide-Zaage
,
H. Frémont
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 3.84 MB
Your tags:
english, 2012
4
Trench DMOS interface trap characterization by three-terminal charge pumping measurement
I. Izuddin
,
M.H. Kamaruddin
,
A.N. Nordin
,
N. Soin
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 907 KB
Your tags:
english, 2012
5
Improved thermal management for GaN power electronics: Silver diamond composite packages
M. Faqir
,
T. Batten
,
T. Mrotzek
,
S. Knippscheer
,
M. Massiot
,
M. Buchta
,
H. Blanck
,
S. Rochette
,
O. Vendier
,
M. Kuball
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 379 KB
Your tags:
english, 2012
6
Defect detection of flip-chip solder joints using modal analysis
Junchao Liu
,
Tielin Shi
,
Ke Wang
,
Zirong Tang
,
Guanglan Liao
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.97 MB
Your tags:
english, 2012
7
Stability analysis in multiwall carbon nanotube bundle interconnects
Saeed Haji-Nasiri
,
Rahim Faez
,
Mohammad Kazem Moravvej-Farshi
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.25 MB
Your tags:
english, 2012
8
Thickness and temperature dependence of the leakage current in hafnium-based Si SOI MOSFETs
Jiseok Kim
,
Siddarth A. Krishnan
,
Sudarshan Narayanan
,
Michael P. Chudzik
,
Massimo V. Fischetti
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 806 KB
Your tags:
english, 2012
9
Structural health monitoring of solder joints in QFN package
I. Gershman
,
J.B. Bernstein
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.18 MB
Your tags:
english, 2012
10
Decapsulation technique using electrochemical etching for failure analysis of WLCSP n-type Si assembled module devices
Takuya Naoe
,
Hirotaka Komoda
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.38 MB
Your tags:
english, 2012
11
Cooperative Hybrid ARQ in Solar Powered Wireless Sensor Networks
Fatemeh Jalali
,
Safieh Khodadoustan
,
Alireza Ejlali
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.12 MB
Your tags:
english, 2012
12
Compact modeling and simulation of Random Telegraph Noise under non-stationary conditions in the presence of random dopants
G. Wirth
,
D. Vasileska
,
N. Ashraf
,
L. Brusamarello
,
R. Della Giustina
,
P. Srinivasan
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 565 KB
Your tags:
english, 2012
13
Silicon nitride etch characteristics in SF6/O2 and C3F6O/O2 plasmas and evaluation of their global warming effects
I.J. Kim
,
H.K. Moon
,
J.H. Lee
,
N.-E. Lee
,
J.W. Jung
,
S.H. Cho
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 730 KB
Your tags:
english, 2012
14
Examination of hot carrier effects of the AlGaAs/InGaAs pHEMT through device simulation
Jason B. Steighner
,
Jiann S. Yuan
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.76 MB
Your tags:
english, 2012
15
A methodological approach for predictive reliability: Practical case studies
H. Frémont
,
G. Duchamp
,
A. Gracia
,
F. Verdier
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.14 MB
Your tags:
english, 2012
16
An automated ultrasonic inspection approach for flip chip solder joint assessment
Ryan S.H. Yang
,
Derek R. Braden
,
Guang-Ming Zhang
,
David M. Harvey
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.25 MB
Your tags:
english, 2012
17
The model parameter extraction and simulation for the effects of gamma irradiation on the DC characteristics of InGaP/GaAs single heterojunction bipolar transistors
Jincan Zhang
,
Yuming Zhang
,
Hongliang Lu
,
Yimen Zhang
,
Shi Yang
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 385 KB
Your tags:
english, 2012
18
Via high resistance failure analysis of LSI devices induced by multiple factors related to process and design
Takuya Naoe
,
Hirotaka Komoda
,
Tamao Ikeuchi
,
Kohichi Yokoyama
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.99 MB
Your tags:
english, 2012
19
Modeling read SNM considering both soft oxide breakdown and negative bias temperature instability
Behrouz Afzal
,
Behzad Ebrahimi
,
Ali Afzali-Kusha
,
Hamid Mahmoodi
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.29 MB
Your tags:
english, 2012
20
A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive
Jue Li
,
Markus Turunen
,
Sini Niiranen
,
Hongtao Chen
,
Mervi Paulasto-Kröckel
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.12 MB
Your tags:
english, 2012
21
Trap detection in electrically stressed AlGaN/GaN HEMTs using optical pumping
D.J. Cheney
,
R. Deist
,
B. Gila
,
J. Navales
,
F. Ren
,
S.J. Pearton
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 659 KB
Your tags:
english, 2012
22
Using a new bathtub curve to correlate quality and reliability
William J. Roesch
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 1.06 MB
Your tags:
english, 2012
23
Impact of high-power stress on dynamic ON-resistance of high-voltage GaN HEMTs
Donghyun Jin
,
Jesús A. del Alamo
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 804 KB
Your tags:
english, 2012
24
Measuring seam/crack formation in interconnect metallization
Peter J. Zampardi
,
Cristian Cismaru
,
Hal Banbrook
,
Bin Li
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 645 KB
Your tags:
english, 2012
25
Development of an RF IV waveform based stress test procedure for use on GaN HFETs
William McGenn
,
Michael J. Uren
,
Johannes Benedikt
,
Paul J. Tasker
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 449 KB
Your tags:
english, 2012
26
Editorial
Peter Ersland
,
Roberto Menozzi
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 109 KB
Your tags:
english, 2012
27
Inside front cover - Editorial board
Journal:
Microelectronics Reliability
Year:
2012
Language:
english
File:
PDF, 37 KB
Your tags:
english, 2012
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