Volume 52; Issue 12

Microelectronics Reliability

Volume 52; Issue 12

1

Simulation model and parameter extraction of Field-Stop (FS) IGBT

Yong Tang, Bo Wang, Ming Chen, Binli Liu

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 2.01 MB

english, 2012

2

High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height

Emeka H. Amalu, N.N. Ekere

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 3.04 MB

english, 2012

3

Electro- and thermo-migration induced failure mechanisms in Package on Package

L. Meinshausen, K. Weide-Zaage, H. Frémont

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 3.84 MB

english, 2012

4

Trench DMOS interface trap characterization by three-terminal charge pumping measurement

I. Izuddin, M.H. Kamaruddin, A.N. Nordin, N. Soin

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 907 KB

english, 2012

5

Improved thermal management for GaN power electronics: Silver diamond composite packages

M. Faqir, T. Batten, T. Mrotzek, S. Knippscheer, M. Massiot, M. Buchta, H. Blanck, S. Rochette, O. Vendier, M. Kuball

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 379 KB

english, 2012

6

Defect detection of flip-chip solder joints using modal analysis

Junchao Liu, Tielin Shi, Ke Wang, Zirong Tang, Guanglan Liao

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.97 MB

english, 2012

7

Stability analysis in multiwall carbon nanotube bundle interconnects

Saeed Haji-Nasiri, Rahim Faez, Mohammad Kazem Moravvej-Farshi

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.25 MB

english, 2012

8

Thickness and temperature dependence of the leakage current in hafnium-based Si SOI MOSFETs

Jiseok Kim, Siddarth A. Krishnan, Sudarshan Narayanan, Michael P. Chudzik, Massimo V. Fischetti

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 806 KB

english, 2012

9

Structural health monitoring of solder joints in QFN package

I. Gershman, J.B. Bernstein

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.18 MB

english, 2012

10

Decapsulation technique using electrochemical etching for failure analysis of WLCSP n-type Si assembled module devices

Takuya Naoe, Hirotaka Komoda

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.38 MB

english, 2012

11

Cooperative Hybrid ARQ in Solar Powered Wireless Sensor Networks

Fatemeh Jalali, Safieh Khodadoustan, Alireza Ejlali

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.12 MB

english, 2012

12

Compact modeling and simulation of Random Telegraph Noise under non-stationary conditions in the presence of random dopants

G. Wirth, D. Vasileska, N. Ashraf, L. Brusamarello, R. Della Giustina, P. Srinivasan

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 565 KB

english, 2012

13

Silicon nitride etch characteristics in SF6/O2 and C3F6O/O2 plasmas and evaluation of their global warming effects

I.J. Kim, H.K. Moon, J.H. Lee, N.-E. Lee, J.W. Jung, S.H. Cho

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 730 KB

english, 2012

14

Examination of hot carrier effects of the AlGaAs/InGaAs pHEMT through device simulation

Jason B. Steighner, Jiann S. Yuan

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.76 MB

english, 2012

15

A methodological approach for predictive reliability: Practical case studies

H. Frémont, G. Duchamp, A. Gracia, F. Verdier

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.14 MB

english, 2012

16

An automated ultrasonic inspection approach for flip chip solder joint assessment

Ryan S.H. Yang, Derek R. Braden, Guang-Ming Zhang, David M. Harvey

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.25 MB

english, 2012

17

The model parameter extraction and simulation for the effects of gamma irradiation on the DC characteristics of InGaP/GaAs single heterojunction bipolar transistors

Jincan Zhang, Yuming Zhang, Hongliang Lu, Yimen Zhang, Shi Yang

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 385 KB

english, 2012

18

Via high resistance failure analysis of LSI devices induced by multiple factors related to process and design

Takuya Naoe, Hirotaka Komoda, Tamao Ikeuchi, Kohichi Yokoyama

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.99 MB

english, 2012

19

Modeling read SNM considering both soft oxide breakdown and negative bias temperature instability

Behrouz Afzal, Behzad Ebrahimi, Ali Afzali-Kusha, Hamid Mahmoodi

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.29 MB

english, 2012

20

A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive

Jue Li, Markus Turunen, Sini Niiranen, Hongtao Chen, Mervi Paulasto-Kröckel

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.12 MB

english, 2012

21

Trap detection in electrically stressed AlGaN/GaN HEMTs using optical pumping

D.J. Cheney, R. Deist, B. Gila, J. Navales, F. Ren, S.J. Pearton

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 659 KB

english, 2012

22

Using a new bathtub curve to correlate quality and reliability

William J. Roesch

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.06 MB

english, 2012

23

Impact of high-power stress on dynamic ON-resistance of high-voltage GaN HEMTs

Donghyun Jin, Jesús A. del Alamo

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 804 KB

english, 2012

24

Measuring seam/crack formation in interconnect metallization

Peter J. Zampardi, Cristian Cismaru, Hal Banbrook, Bin Li

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 645 KB

english, 2012

25

Development of an RF IV waveform based stress test procedure for use on GaN HFETs

William McGenn, Michael J. Uren, Johannes Benedikt, Paul J. Tasker

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 449 KB

english, 2012

26

Editorial

Peter Ersland, Roberto Menozzi

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 109 KB

english, 2012

27

Inside front cover - Editorial board

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 37 KB

english, 2012