Structural health monitoring of solder joints in QFN...

Structural health monitoring of solder joints in QFN package

I. Gershman, J.B. Bernstein
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Volume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.07.001
File:
PDF, 1.18 MB
english, 2012
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