Decapsulation technique using electrochemical etching for...

Microelectronics Reliability 2012 Vol. 52; Iss. 12

Decapsulation technique using electrochemical etching for failure analysis of WLCSP n-type Si assembled module devices

Takuya Naoe, Hirotaka Komoda
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.07.003
File:
PDF, 1.38 MB
english, 2012
Conversion to is in progress
Conversion to is failed