An automated ultrasonic inspection approach for flip chip...

An automated ultrasonic inspection approach for flip chip solder joint assessment

Ryan S.H. Yang, Derek R. Braden, Guang-Ming Zhang, David M. Harvey
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Volume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.07.018
File:
PDF, 1.25 MB
english, 2012
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