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Interdiffusion at the interface between Sn-based solders and Cu substrate
Yang, Yang, Li, Yongzhi, Lu, Hao, Yu, Chun, Chen, JunmeiVolume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2012.08.013
Date:
February, 2013
File:
PDF, 1.05 MB
english, 2013