Ratcheting behavior of sandwiched assembly joined by...

Microelectronics Reliability 2013 / 4 Vol. 53; Iss. 4

Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging

Chen, Gang, Zhang, Ze-Sheng, Mei, Yun-Hui, Li, Xin, Lu, Guo-Quan, Chen, Xu
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2012.11.011
Date:
April, 2013
File:
PDF, 1009 KB
english, 2013
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