Volume 53; Issue 4

Microelectronics Reliability

Volume 53; Issue 4

1

An analytical two dimensional subthreshold behavior model to study the nanoscale GCGS DG Si MOSFET including interfacial trap effects

Bentrcia, T., Djeffal, F., Chahdi, M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 557 KB

english, 2013

2

An analytical approach to calculate effective channel length in graphene nanoribbon field effect transistors

Ghadiry, M., Nadi, M., Bahadorian, M., Manaf, Asrulnizam ABD, Karimi, H., Sadeghi, Hatef

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 657 KB

english, 2013

3

Multi-level storage in a nano-floating gate MOS capacitor using a stepped control oxide

Seo, Jun-Hyuk, Kim, Ji-Young, Kim, Young-Bae, Kim, Dong-Wook, Kim, Haeri, Cho, Hyun, Choi, Duck-Kyun

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 923 KB

english, 2013

4

Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging

Chen, Gang, Zhang, Ze-Sheng, Mei, Yun-Hui, Li, Xin, Lu, Guo-Quan, Chen, Xu

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1009 KB

english, 2013

5

Design and simulation of MOSCNT with band engineered source and drain regions

Moghadam, Narjes, Moravvej-Farshi, Mohammad Kazem, Aziziyan, Mohammad Reza

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.11 MB

english, 2013

6

Design and simulation of hybrid CMOS–SET circuits

Jana, Anindya, Basanta Singh, N., Sing, J.K., Sarkar, Subir Kumar

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.51 MB

english, 2013

7

Correlation between P3HT inter-chain structure and Jsc of P3HT:PC[70]BM blends for solar cells

Balderrama, V.S., Estrada, M., Viterisi, A., Formentin, P., Pallarés, J., Ferré-Borrull, J., Palomares, E., Marsal, L.F.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 753 KB

english, 2013

8

Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures

Omiya, Masaki, Koiwa, Kozo, Shishido, Nobuyuki, Kamiya, Shoji, Chen, Chuantong, Sato, Hisashi, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Suzuki, Toshiaki, Nokuo, Takeshi

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.20 MB

english, 2013

9

A highly reliable NBTI Resilient 6T SRAM cell

Singh, Jawar, Vijaykrishnan, N.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 969 KB

english, 2013

10

Thermal uniformity of packaging multiple light-emitting diodes embedded in aluminum-core printed circuit boards

Long, Xing-Ming, Liao, Rui-Jin, Zhou, Jing, Zeng, Zhi

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.99 MB

english, 2013

11

Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact

Yao, Yao, Keer, Leon M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.87 MB

english, 2013

12

A new procedure for eliminating the geometric component from charge pumping: Application for NBTI and radiation issues

Tahi, Hakim, Djezzar, Boualem, Benabdelmoumene, Abdelmadjid

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.23 MB

english, 2013

13

Experimental study of bump void formation according to process conditions

Na, Seong-Hun, Lim, Seung-Kyu, Kim, Jin-Soo, Park, Hwa-Sun, Oh, Heung-Jae, Choi, Jin-Won, Suh, Su-Jeong

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.89 MB

english, 2013

14

Inside front cover - Editorial board

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 36 KB

english, 2013

15

ACF-COG interconnection conductivity inspection system using conductive area

Sheng, Xinjun, Jia, Lei, Xiong, Zhenhua, Wang, Zhiping, Ding, Han

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.09 MB

english, 2013

16

Optimum control of microprocessor throughput under thermal and energy saving constraints

Gołda, Adam T., Kos, Andrzej J.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 706 KB

english, 2013

17

A new MagFET-based integrated current sensor highly immune to EMI

Aiello, Orazio, Fiori, Franco

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 882 KB

english, 2013

18

FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process

Ong, Ernest E.S., Abdullah, M.Z., Loh, W.K., Ooi, C.K., Chan, R.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.24 MB

english, 2013

19

Evaluation of temperature distribution of LED module

Fu, Han-Kuei, Wang, Chien-Ping, Chiang, Hsin-Chien, Chen, Tzung-Te, Chen, Chiu-Ling, Chou, Pei-Ting

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 861 KB

english, 2013

20

In situ high temperature creep deformation of micro-structure with metal film wire on flexible membrane using geometric phase analysis

Wang, Qinghua, Kishimoto, Satoshi, Xie, Huimin, Liu, Zhanwei, Lou, Xinhao

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.03 MB

english, 2013