Diffusion Barrier Deposition on a Copper Surface by Atomic Layer Deposition
K.-E. Elers, V. Saanila, P. J. Soininen, W.-M. Li, J. T. Kostamo, S. Haukka, J. Juhanoja, W. F. A. BeslingVolume:
8
Year:
2002
Language:
english
DOI:
10.1002/1521-3862(20020704)8:43.0.co;2-f
File:
PDF, 247 KB
english, 2002