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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric
Frank, T., Moreau, S., Chappaz, C., Leduc, P., Arnaud, L., Thuaire, A., Chery, E., Lorut, F., Anghel, L., Poupon, G.Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2012.06.021
Date:
January, 2013
File:
PDF, 2.52 MB
english, 2013