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Volume 53; Issue 1
Main
Microelectronics Reliability
Volume 53; Issue 1
Microelectronics Reliability
Volume 53; Issue 1
1
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
Tu, K.N.
,
Hsiao, Hsiang-Yao
,
Chen, Chih
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 566 KB
Your tags:
english, 2013
2
High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force
Li, Xin
,
Chen, Gang
,
Chen, Xu
,
Lu, Guo-Quan
,
Wang, Lei
,
Mei, Yun-Hui
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.64 MB
Your tags:
english, 2013
3
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric
Frank, T.
,
Moreau, S.
,
Chappaz, C.
,
Leduc, P.
,
Arnaud, L.
,
Thuaire, A.
,
Chery, E.
,
Lorut, F.
,
Anghel, L.
,
Poupon, G.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.52 MB
Your tags:
english, 2013
4
Reliability of micro-interconnects in 3D IC packages
Robert Kao, C.
,
Wu, Albert T.
,
Tu, King-Ning
,
Lai, Yi-Shao
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 110 KB
Your tags:
english, 2013
5
Reliability of key technologies in 3D integration
Ko, Cheng-Ta
,
Chen, Kuan-Neng
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.06 MB
Your tags:
english, 2013
6
IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging
Chen, Wen-Hwa
,
Yu, Ching-Feng
,
Cheng, Hsien-Chie
,
Tsai, Yu-min
,
Lu, Su-Tsai
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.69 MB
Your tags:
english, 2013
7
Misalignment induced shear deformation in 3D chip stacking: A parametric numerical assessment
Shen, Y.-L.
,
Johnson, R.W.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.42 MB
Your tags:
english, 2013
8
Analytical estimates of stress around a doubly periodic arrangement of through-silicon vias
Udupa, Anirudh
,
Subbarayan, Ganesh
,
Koh, Cheng-Kok
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 522 KB
Your tags:
english, 2013
9
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test
Liu, Xi
,
Chen, Qiao
,
Sundaram, Venkatesh
,
Tummala, Rao R.
,
Sitaraman, Suresh K.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.67 MB
Your tags:
english, 2013
10
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics
Chen, Y.J.
,
Chung, C.K.
,
Yang, C.R.
,
Kao, C.R.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.48 MB
Your tags:
english, 2013
11
Annealing and thickness related performance and degradation of polymer solar cells
Zhao, Zhouying
,
Rice, Lynn
,
Efstathiadis, Harry
,
Haldar, Pradeep
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 665 KB
Your tags:
english, 2013
12
Revisiting MOSFET threshold voltage extraction methods
Ortiz-Conde, Adelmo
,
García-Sánchez, Francisco J.
,
Muci, Juan
,
Terán Barrios, Alberto
,
Liou, Juin J.
,
Ho, Ching-Sung
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.46 MB
Your tags:
english, 2013
13
Size and constraint effects on interfacial fracture behavior of microscale solder interconnects
Li, B.
,
Zhang, X.P.
,
Yang, Y.
,
Yin, L.M.
,
Pecht, M.G.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.63 MB
Your tags:
english, 2013
14
An improved multilevel cell programming technique for 4-bits/cell localized trapping SONOS memory devices
Xu, Yue
,
Wu, Chun-bo
,
Ji, Xiao-li
,
Yan, Feng
,
Shi, Yi
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 579 KB
Your tags:
english, 2013
15
Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method
Ikeda, Toru
,
Kanno, Toshifumi
,
Shishido, Nobuyuki
,
Miyazaki, Noriyuki
,
Tanaka, Hiroyuki
,
Hatao, Takuya
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.01 MB
Your tags:
english, 2013
16
Analysis and mitigation of BTI aging in register file: An application driven approach
Kothawade, Saurabh
,
Chakraborty, Koushik
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1002 KB
Your tags:
english, 2013
17
Reliability assessment of RFID reader through prognostics and health management
Huang, Chien-Yi
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.14 MB
Your tags:
english, 2013
18
Inside front cover - Editorial board
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 37 KB
Your tags:
english, 2013
19
Research and design of a power management chip for wireless powering capsule endoscopy
Chen, Jianguang
,
Feng, Liang
,
Cheng, Yuhua
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 983 KB
Your tags:
english, 2013
20
Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps
Chang, Y.W.
,
Peng, H.Y.
,
Yang, R.W.
,
Chen, Chih
,
Chang, T.C.
,
Zhan, C.J.
,
Juang, J.Y.
,
Huang, Annie T.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 833 KB
Your tags:
english, 2013
21
Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias
Jiang, Tengfei
,
Ryu, Suk-Kyu
,
Zhao, Qiu
,
Im, Jay
,
Huang, Rui
,
Ho, Paul S.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.88 MB
Your tags:
english, 2013
22
Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests
Kar, Yap Boon
,
Hui, Tan Cai
,
Agileswari, Ramasamy
,
Lo, Calvin
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.62 MB
Your tags:
english, 2013
23
An efficient technique to select logic nodes for single event transient pulse-width reduction
Mahatme, Nihaar N.
,
Chatterjee, Indranil
,
Patki, Akash
,
Limbrick, Daniel B.
,
Bhuva, Bharat L.
,
Schrimpf, Ronald D.
,
Robinson, William
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 307 KB
Your tags:
english, 2013
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