Study of Through-Silicon-Via Impact on the 3-D Stacked IC...

IEEE Transactions on Very Large Scale Integration (VLSI) Systems 2013 / 05 Vol. 21; Iss. 5

Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout

Kim, Dae Hyun, Athikulwongse, Krit, Lim, Sung Kyu
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Volume:
21
Language:
english
Journal:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
DOI:
10.1109/TVLSI.2012.2201760
Date:
May, 2013
File:
PDF, 1.88 MB
english, 2013
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